LATERAL DIFFUSION FIELD EFFECT TRANSISTOR WITH DRAIN REGION SELF-ALIGNED TO GATE ELECTRODE
First Claim
1. A method manufacturing a semiconductor structure comprising:
- forming a gate dielectric and a gate electrode on a semiconductor substrate;
forming a first gate spacer directly on said gate electrode;
forming a second gate spacer directly on said first gate spacer;
removing a first portion of said second gate spacer on a source side of said gate electrode;
forming a source region in said semiconductor substrate on said source side of said gate electrode after removal of said first portion of said second gate spacer;
forming a drain region in said semiconductor substrate on a drain side of said gate electrode; and
removing a second portion of said second gate spacer on said drain side of said gate electrode after formation of said drain region.
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Accused Products
Abstract
A disposable structure displaced from an edge of a gate electrode and a drain region aligned to the disposable structure is formed. Thus, the drain region is self-aligned to the edge of the gate electrode. The disposable structure may be a disposable spacer, or alternately, the disposable structure may be formed simultaneously with, and comprise the same material as, a gate electrode. After formation of the drain regions, the disposable structure is removed. The self-alignment of the drain region to the edge of the gate electrode provides a substantially constant drift distance that is independent of any overlay variation of lithographic processes.
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Citations
20 Claims
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1. A method manufacturing a semiconductor structure comprising:
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forming a gate dielectric and a gate electrode on a semiconductor substrate; forming a first gate spacer directly on said gate electrode; forming a second gate spacer directly on said first gate spacer; removing a first portion of said second gate spacer on a source side of said gate electrode; forming a source region in said semiconductor substrate on said source side of said gate electrode after removal of said first portion of said second gate spacer; forming a drain region in said semiconductor substrate on a drain side of said gate electrode; and removing a second portion of said second gate spacer on said drain side of said gate electrode after formation of said drain region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method manufacturing a semiconductor structure comprising:
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forming a gate dielectric and a gate electrode material layer on a semiconductor substrate; forming a gate electrode and a disposable conductive portion disjoined from said gate electrode by patterning said gate electrode material layer; forming a dielectric gate spacer directly on sidewalls of said gate electrode and said disposable conductive portion, wherein said dielectric gate spacer contains two holes laterally enclosing said gate electrode and said disposable conductive portion; and forming a source region and a drain region in said semiconductor substrate, wherein an edge of said source region is substantially vertically coincident with an outer sidewall of a first portion of said dielectric gate spacer laterally abutting said gate electrode, and wherein an edge of said drain region is substantially vertically coincident with an outer sidewall of a second portion of said dielectric gate spacer laterally abutting said disposable conductive portion. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A semiconductor structure comprising:
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a first conductivity type well having a doping of a first conductivity type and located in a semiconductor substrate; a drift region having a doping of a second conductivity type which is the opposite of said first conductivity type, and located in said semiconductor substrate; a gate dielectric vertically abutting said first conductivity type well and said drift region; a gate electrode vertically abutting said gate dielectric and straddling over said first conductivity type well and said drift region; and a dielectric gate spacer of unitary construction and including two holes, wherein a first hole is filled by said gate electrode, and wherein a second hole is filled with a dielectric material. - View Dependent Claims (18, 19, 20)
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Specification