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Semiconductor device and manufacturing method thereof

  • US 20090261476A1
  • Filed: 04/18/2008
  • Published: 10/22/2009
  • Est. Priority Date: 04/18/2007
  • Status: Abandoned Application
First Claim
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1. A manufacturing method of a semiconductor device, comprising the steps of:

  • providing a carrier board having a plurality of conductive circuits disposed thereon and a plurality of chips with active surfaces having solder pads thereon, wherein conductive bumps are disposed on the solder pads;

    mounting the chips on the carrier board, wherein the chips are spaced away from each other and cover one end of each of the conductive circuits, so as to expose the conductive circuits from spacing between the chips;

    filling the spacing between the chips with a dielectric layer, and forming a plurality of openings in the dielectric layer at periphery of the chips so as to expose a part of the conductive circuits;

    forming a resist layer covering surfaces of the chips and the dielectric layer, and forming openings in the resist layer for exposing the conductive bumps to the openings of the dielectric layer;

    forming a metal layer in the openings of the dielectric layer and the resist layer for electrically connecting the conductive bumps of the chips and the conductive circuits; and

    removing the resist layer, cutting along the dielectric layer between the chips and removing the carrier board for separating the chips from each other and exposing the conductive circuits from non-active surfaces of the chips.

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