ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION, CONNECTED BODY SEMICONDUCTOR DEVICE

• US 20090261483A1
• Filed: 06/26/2009
• Published: 10/22/2009
• Est. Priority Date: 11/29/2002
• Status: Active Grant

• Current Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: SUTO, Hoko, YUSA, Masami, KATOGI, Shigeki
• Granted Patent: US 7,795,325 B2
• Time in Patent Office: Days
• US Class Current: 257/783
• CPC Class Codes: C08F 291/00 Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
• CPC Class Codes: C09J 4/06 Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29298 Fillers
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01054 : Xenon [Xe]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/07811 : Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01R 4/04 : using electrically conductive adhesives
• CPC Class Codes: H05K 3/305 : Affixing by adhesive
• CPC Class Codes: H05K 3/323 : by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: Y10T 428/2857 : including metal or compound thereof or natural rubber
• CPC Class Codes: Y10T 428/2878 : including addition polymer from unsaturated monomer
• CPC Class Codes: Y10T 428/2883 : including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
• CPC Class Codes: Y10T 428/2887 : including nitrogen containing polymer [e.g., polyacrylonitrile, polymethacrylonitrile, etc.]
• CPC Class Codes: Y10T 428/2891 : including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
• CPC Class Codes: Y10T 428/2896 : including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Abstract

An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C.

Claims

1-18. -18. (canceled)

19. A film-shaped adhesive composition comprising the following components (a) to (d):

(a) a thermoplastic resin;

(b) a radical-polymerizable compound including two or more (meth)acryloyl groups;

(c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200°

C.; and

(d) a liquid rubber having a viscosity of 10 to 1000 Pa·

s at 25°

C.

20. An adhesive composition according to claim 19, wherein the component (d) is a liquid rubber having a viscosity of 10 to 1000 Pa·

s at 25°

C. selected from the group consisting of polyisoprene, polybutadiene, styrene-butadiene copolymer and acrylonitrile-butadiene copolymer.

21. An adhesive composition according to claim 19, comprising:

50 to 250 parts by weight of the component (b);

0.5 to 30 parts by weight of the component (c); and

to 50 parts by weight of the component (d),

with respect to 100 parts by weight of the component (a).

22. An adhesive composition according to claim 19,

comprising 0.1 to 30% by volume of conductive particles with respect to a total volume of the adhesive composition.

23. An adhesive composition for circuit connection comprising the adhesive composition according to claim 19,

wherein the adhesive composition for circuit connection is capable of bonding circuit members, each of which has a circuit electrode on a principal face of a circuit substrate thereof, to face with each other such that the circuit electrode of one circuit member and the circuit electrode of another circuit member are electrically connected.

24. A connected body comprising:

a first circuit member including a first circuit electrode on a principal face of a first circuit substrate thereof;

a second circuit member including a second circuit electrode on a principal face of a second circuit substrate thereof; and

a circuit connection member provided between the first circuit member and the second circuit member in a state that the first circuit electrode and the second circuit electrode face each other and electrically connecting the first circuit electrode and the second circuit electrode,

wherein the circuit connection member comprises the adhesive composition according to claim 19 or a cured material thereof.

25. A connected body comprising:

a first circuit member including a first circuit electrode on a principal face of a first circuit substrate thereof;

a second circuit member including a second circuit electrode on a principal face of a second circuit substrate thereof; and

a circuit connection member provided between the first circuit member and the second circuit member in a state that the first circuit electrode and the second circuit electrode face each other and electrically connecting the first circuit electrode and the second circuit electrode,

wherein the circuit connection member comprises the adhesive composition according to claim 22 or a cured material thereof,

and the first circuit electrode and the second circuit electrode are electrically connected by the conductive particles in the adhesive composition or the cured material thereof.

26. A semiconductor device comprising:

a semiconductor element including a connecting electrode;

a circuit member including a circuit electrode on a principal face of a circuit substrate thereof; and

a circuit connection member provided between the semiconductor element and the circuit member in a state that the connecting electrode and the circuit electrode face each other and electrically connecting the connecting electrode and the circuit electrode,

wherein the circuit connection member comprises the adhesive composition according to claim 19 or a cured material thereof.

27. A semiconductor device comprising:

a semiconductor element including a connecting electrode;

a circuit member including a circuit electrode on a principal face of a circuit substrate thereof; and

a circuit connection member provided between the semiconductor element and the circuit member in a state that the connecting electrode and the circuit electrode face each other and electrically connecting the connecting electrode and the circuit electrode,

wherein the circuit connection member comprises the adhesive composition according to claim 22 or a cured material thereof, and the connecting electrode and the circuit electrode are electrically connected by the conductive particles in the adhesive composition or the cured material thereof.