Control Device

• US 20090262503A1
• Filed: 02/19/2009
• Published: 10/22/2009
• Est. Priority Date: 03/31/2008
• Status: Active Grant

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: KANEKO, Yujiro, Asano, Masahiko, Yoshinari, Hideto
• Granted Patent: US 8,184,438 B2
• Time in Patent Office: Days
• US Class Current: 361/706
• CPC Class Codes: H05K 7/026 Multiple connections subassemblies
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence

Abstract

A control device as a module comprises a control board, a sub-module and a housing cover. A microcomputer is mounted on the control board. The sub-module has a sub-module case provided with a wiring layer into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.

Claims

1. A control device as a module comprising:

a control board mounting a microcomputer;

a sub-module having a sub-module case provided with a wiring layer into a wall of the sub-module case and electronic parts mounted in the sub-module case to electrically connect to the control board through the wiring layer;

a housing cover accommodating the control board and the sub-module; and

a housing base joined with the housing cover,

wherein an accommodation portion having a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover, and

the sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.

2. The control device according to claim 1,

wherein the sub-module has at least two electronic parts with different shapes from each other.

3. The control device according to claim 1,

wherein the accommodation portion has the shape individually corresponding to each of the electronic parts.

4. The control device according to claim 1,

wherein the heat radiation adhesive is provided in the accommodation portion before curing and its curing process is performed after mounting the sub-module on the housing cover.

5. The control device according to claim 1,

wherein the heat radiation adhesive is in contact with side surfaces of the electronic parts in addition to the contact with the housing cover.

6. The control device according to claim 1,

wherein the heat radiation adhesive is in contact with the housing cover side of the electronic parts and its contact area is less than a half of entire surface area of the electronic parts.

7. The control device according to claim 1,

wherein the control board and sub-module are fixed to said housing cover.

8. The control device according to claim 1,

wherein a heat radiation fin is provided on an outer surface of the housing cover opposite to a region where the accommodation portion is positioned on an inner surface of the housing cover.

9. The control device according to claim 1,

wherein the housing cover is made of aluminum or aluminum alloy.

10. The control device according to claim 1,

wherein the heat radiation adhesive is made of silicone resin and its thermal conductivity is 0.5 to 5 (W/mK), modulus of elasticity is 1 to 1000 (kP) and penetration is 10 to 50 namely 1/10 mm.

11. The control device according to claim 1,

wherein the electronic parts are projected from an opening of the sub-module case in an exposing state, and

the sub-module is mounted on the housing cover so that the electronic parts are held with the heat radiation adhesive without contacting the bottom of the accommodation portion of the housing cover.