HEAT DISSIPATION DEVICE

• US 20090266513A1
• Filed: 09/29/2008
• Published: 10/29/2009
• Est. Priority Date: 04/28/2008
• Status: Abandoned Application

• Current Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Original Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Inventors: XIONG, HAI-GANG, ZHOU, ZHI-YONG
• Application Number:
  US12/239,832
• Publication Number:
  US 20090266513A1
• Time in Patent Office: Days
• US Class Current: 165/80.300
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion and a receiving recession opposing the inserting protrusion. The inserting protrusion protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate. The receiving recession recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader.

Claims

1. A heat dissipation device adapted for removing heat from a heat-generating electronic device, comprising:

a base comprising a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader, the base plate defining an opening therein, the heat pipe group having an inserting protrusion which protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate and having a receiving recession which recesses upwardly from a bottom surface of the heat pipe group, and the spreader being received in the receiving recession; and

a first fin unit arranged on a top surface of the base.

2. The heat dissipation device as claimed in claim 1, wherein the inserting protrusion has a top surface which is coplanar with a top surface of the base plate.

3. The heat dissipation device as claimed in claim 1, wherein the receiving recession is located under the inserting protrusion and in complementary with the inserting protrusion.

4. The heat dissipation device as claimed in claim 1, wherein the heat pipe group consists of a plurality of flexuous heat pipes which have elongated portions arranged side by side to each other to define an evaporating part thereof.

5. The heat dissipation device as claimed in claim 4, wherein the inserting protrusion is formed on a top surface of the evaporating part and opposite to the receiving recession which is formed on a bottom surface of the evaporating part.

6. The heat dissipation device as claimed in claim 4, wherein the heat pipe group further comprises four condensing parts extending outwardly from the evaporating part along corresponding adjacent edges of the base plate to surround the evaporating part.

7. The heat dissipation device as claimed in claim 1, wherein the opening is located in a center of the base plate and has a same rectangular shape as the inserting protrusion, and the base plate has a protecting flange which extends perpendicularly and downwardly from an edge thereof and surrounds the heat pipe group under the base plate.

8. The heat dissipation device as claimed in claim 1, wherein the spreader is received in the receiving recession of the heat pipe group and has a bottom surface projecting downwardly from a bottom surface of the heat pipe group.

9. The heat dissipation device as claimed in claim 1, wherein the first fin unit is fixed to a top surface of the base plate and in a directly contact with a top surface of the inserting protrusion of the heat pipe group.

10. The heat dissipation device as claimed in claim 1, further comprising a second fin unit which is attached to a bottom surface of the heat pipe group at a location beside the spreader.

18. The heat dissipation device as claimed in claim 1, wherein the first fin unit is fixed to a top surface of the base plate and in a direct contact with a top surface of the inserting protrusion of the heat pipe group.

19. The heat dissipation device as claimed in claim 18, further comprising a second fin unit which is attached to a bottom surface of the heat pipe group at a location beside the spreader.

11. A heat dissipation device adapted for removing heat from a heat-generating electronic device, comprising:

a base comprising a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader, the base plate defining therein an opening, the heat pipe group having an inserting protrusion which protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate and having a receiving recession which recesses upwardly from a bottom surface of the heat pipe group, the spreader being received in the receiving recession; and

a first fin unit arranged on a top surface of the base;

wherein the receiving recession is located under the inserting protrusion and in complementary with the inserting protrusion.

12. The heat dissipation device as claimed in claim 11, wherein the inserting protrusion has a top surface which is coplanar with a top surface of the base plate.

13. The heat dissipation device as claimed in claim 11, wherein the heat pipe group consists of a plurality of flexuous heat pipes which have elongated portions arranged side by side to each other to define an evaporating part thereof.

14. The heat dissipation device as claimed in claim 13, wherein the inserting protrusion is formed on a top surface of the evaporating part and opposite to the receiving recession which is formed on a bottom surface of the evaporating part.

15. The heat dissipation device as claimed in claim 14, wherein the heat pipe group further comprises four condensing parts extending outwardly from the evaporating part along corresponding adjacent edges of the base plate to surround the evaporating part.

16. The heat dissipation device as claimed in claim 15, wherein the opening is located in a center of the base plate and a the same rectangular shape as the inserting protrusion, and the base plate has a protecting flange which extends perpendicularly and downwardly from an edge thereof and surrounds the heat pipe group under the base plate.

17. The heat dissipation device as claimed in claim 16, wherein the spreader is received in the receiving recession of the heat pipe group and has a bottom surface projecting downwardly from a bottom surface of the heat pipe group.