WIRELESS IC DEVICE AND ELECTRONIC APPARATUS

• US 20090266900A1
• Filed: 07/15/2009
• Published: 10/29/2009
• Est. Priority Date: 07/17/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: KATAYA, Takeshi, DOKAI, Yuya, KATO, Noboru, ISHINO, Satoshi, IKEMOTO, Nobuo, TANAKA, Mikiko, KIMURA, Ikuhei
• Granted Patent: US 7,997,501 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/1531 the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 9/28 Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00
• CPC Class Codes: H03H 2007/386 Multiple band impedance matching
• CPC Class Codes: H03H 7/38 Impedance-matching networks
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

Claims

1. A wireless IC device comprising:

a wireless IC arranged to transmit and receive signals;

a feeder circuit substrate including a feeder circuit incorporating an inductance element connected to the wireless IC in a galvanically conductive state and in which a feeder electrode coupled to the inductance element is provided on a surface of the substrate or an inside of the substrate; and

a radiation plate that is electromagnetically coupled to the feeder electrode.

2. The wireless IC device according to claim 1, further comprising a mounting electrode provided on a surface of the feeder circuit substrate.

3. The wireless IC device according to claim 2, wherein the mounting electrode is not electrically connected to the feeder circuit.

4. The wireless IC device according to claim 2, wherein, between the feeder electrode and the mounting electrode, the mounting electrode is disposed at an outer edge portion of the feeder circuit substrate.

5. The wireless IC device according to claim 2, wherein the mounting electrode is disposed on a side surface of the feeder circuit substrate.

6. The wireless IC device according to claim 5, wherein the mounting electrode is disposed on each of two opposite side surfaces of the feeder circuit substrate.

7. The wireless IC device according to claim 5, wherein the mounting electrode is disposed on each of the two opposite side surfaces of the feeder circuit substrate at line-symmetrical positions.

8. The wireless IC device according to claim 5, wherein the mounting electrode is disposed at a distance spaced away from a lower surface of the feeder circuit substrate.

9. The wireless IC device according to claim 5, wherein the feeder circuit substrate includes a laminated body in which an insulating material layer and an electrode layer are laminated, and the mounting electrode is arranged so as to expose the electrode layer on at least one of surfaces of the laminated body.

10. The wireless IC device according to claim 5, wherein the feeder circuit substrate includes a laminated body in which an insulating material layer and an electrode layer are laminated, and the mounting electrode is arranged in a recess formed on at least one of side surfaces of the laminated body.

11. The wireless IC device according to claim 1, further comprising a resonant circuit that is provided in the feeder circuit substrate.

12. The wireless IC device according to claim 1, further comprising a matching circuit that is provided in the feeder circuit substrate.

13. The wireless IC device according to claim 1, wherein the radiation plate is provided on a surface and/or inside of a radiation substrate.

14. The wireless IC device according to claim 1, further comprising a substrate-side mounted electrode that is provided on a surface of a radiation substrate in which the radiation plate is provided, wherein the substrate-side mounted electrode is electrically connected to the mounting electrode of the feeder circuit substrate.

15. The wireless IC device according to claim 1, wherein the substrate-side mounted electrode is electrically connected to the radiation plate.

16. The wireless IC device according to claim 1, wherein the feeder electrode is arranged over a range from a surface, facing the radiation plate, of the feeder circuit substrate to at least one of surface of the feeder circuit substrate that does not face the radiation plate.

17. The wireless IC device according to claim 1, wherein a plurality of the radiation plates are provided.

18. The wireless IC device according to claim 1, wherein a plurality of the feeder electrodes and/or a plurality of the mounting electrodes are provided on a surface of the feeder circuit substrate.

19. The wireless IC device according to claim 1, further comprising a sealing resin that is provided between a radiation substrate, on which the radiation plate is provided, and the feeder circuit substrate.

20. The wireless IC device according to claim 1, wherein the feeder circuit includes at least two inductance elements having different inductances.

21. The wireless IC device according to claim 1, wherein

the feeder circuit substrate includes the inductance element and a capacitance element at different positions in plan view,

the capacitance element is electromagnetically coupled to a feeder electrode that is different from the feeder electrode to which the inductance element is electromagnetically coupled, and

the different radiation plates are respectively coupled to the feeder electrodes in a galvanically non-conductive state.

22. The wireless IC device according to claim 11, wherein the resonant circuit or the matching circuit is arranged so that the wireless IC is galvanically connected to the feeder electrode.

23. The wireless IC device according to claim 11, wherein the resonant circuit or the matching circuit includes an element incorporated in the feeder circuit substrate and an element mounted on the feeder circuit substrate.

24. The wireless IC device according to claim 11, wherein the resonant circuit or the matching circuit includes an element provided for the feeder circuit substrate and an element mounted on a substrate for which the radiation plate is provided.

25. The wireless IC device according to claim 1, wherein the feeder circuit substrate is defined by a multilayer substrate.

26. The wireless IC device according to claim 1, further comprising a protection film arranged to cover at least one of a wireless IC chip arranged to transmit and receive signals, the feeder circuit substrate and the radiation plate.

27. The wireless IC device according to claim 1, wherein an imaginary portion of an input/output impedance of the wireless IC device conjugates with the imaginary portion of an impedance when viewed from a portion of the feeder circuit substrate, connected to the wireless IC, toward the feeder electrode within or near a range of frequency used.

28. An electronic apparatus comprising the wireless IC device according to claim 1.

29. An electronic apparatus comprising the wireless IC device according to claim 1, wherein the radiation plate is provided for a printed wiring board incorporated in an apparatus casing, and the feeder electrode provided for the feeder circuit substrate is electromagnetically coupled to the radiation plate.