LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES

• US 20090267085A1
• Filed: 10/26/2005
• Published: 10/29/2009
• Est. Priority Date: 03/11/2005
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: Kim, Dae Won, Kim, Hong San, Lee, Chung Hoon, Choi, Hyuck Jung, Lee, Keon Young
• Granted Patent: US 8,076,680 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Claims

1. A light emitting diode (LED) package, comprising:

a package body; and

an LED chip mounted on the package body and having an array of light emitting cells coupled in series.

2. The LED package as claimed in claim 1, wherein the LED chip comprises:

a substrate; and

light emitting cells formed on the substrate and electrically insulated from the substrate.

3. The LED package as claimed in claim 2, wherein the LED chip comprises wires connecting the light emitting cells to one another in series.

4. The LED package as claimed in claim 2, further comprising a submount interposed between the LED chip and the package body, the submount having electrode patterns corresponding to the light emitting cells, wherein the light emitting cells are connected to one another in series through the electrode patterns.

5. The LED package as claimed in claim 1, wherein the LED chip further comprises a rectification bridge unit for applying predetermined rectified power to the array of light emitting cells coupled in series.

6. The LED package as claimed in claim 1, wherein the LED chip further comprises one or more arrays of light emitting cells coupled in series, and the arrays of light emitting cells coupled in series are connected in reverse parallel to one another.

7. The LED package as claimed in claim 1, further comprising a molding member covering the LED chip.

8. The LED package as claimed in claim 7, wherein the package body is a printed circuit board with lead electrodes, and the LED chip is electrically connected to the lead electrodes.

9. The LED package as claimed in claim 7, further comprising a reflective portion surrounding the LED chip to reflect light that is emitted from the LED chip and incident thereon.

10. The LED package as claimed in claim 1, further comprising a phosphor converting the wavelength of light emitted from the LED chip.

11. The LED package as claimed in claim 1, further comprising:

a pair of lead frames spaced apart from each other; and

a heat sink,

wherein the package body supports the pair of lead frames and the heat sink and has an opening for exposing a portion of each of the lead frames and an upper portion of the heat sink, and the LED chip is mounted on the heat sink.

12. The LED package as claimed in claim 11, wherein the heat sink is connected directly to one of the lead frames at a side surface thereof and is spaced apart from the other of the lead frames.

13. The LED package as claimed in claim 12, wherein the heat sink and the lead frame connected directly to the heat sink are formed integrally with each other.

14. The LED package as claimed in claim 12, wherein the heat sink comprises:

a base;

a protrusion protruding upwardly at a central portion of the base; and

a lead frame-receiving groove for receiving one of the lead frames at a side surface of the protrusion, and

the directly connected lead frame is inserted into the lead frame-receiving groove.

15. The LED package as claimed in claim 11, wherein the package body has a through-hole exposed through the opening,

the pair of lead frames comprise a pair of inner frames exposed inside the opening of the package body, and outer frames extending from the respective inner frames and protruding to the outside of the package body, and

the heat sink is combined with a lower portion of the package body through the through-hole and is exposed through the opening.

16. The LED package as claimed in claim 15, wherein the heat sink comprises:

a base combined with the lower portion of the package body;

a protrusion protruding upwardly at a central portion of the base and coupled with the through-hole; and

a latching step formed on a side surface of the protrusion.

17. An LED lamp, comprising:

a first lead having a top portion and a pin-type or snap-type leg extending from the top portion;

a second lead arranged to be spaced apart from the first lead and having a pin-type or snap-type leg corresponding to the first lead;

an LED chip mounted on the top portion and having an array of light emitting cells coupled in series;

bonding wires for connecting the LED chip to the first and second leads, respectively; and

a molding member for encapsulating the top portion of the first lead, the LED chip and a portion of the second lead.

18. The LED lamp as claimed in claim 17, wherein the top portion of the first lead has a cavity, and the LED chip is mounted inside the cavity.

19. The LED lamp as claimed in claim 17, wherein if the first and second leads have pin-type legs, each of the first and second leads has two pin-type legs.

20. The LED lamp as claimed in claim 17, further comprising a heat sink extending from the top portion of the first lead in parallel with the leg of the first lead, wherein the heat sink has grooves on the surface thereof.

21. The LED lamp as claimed in claim 17, wherein the LED chip comprises:

a substrate; and

light emitting cells formed on the substrate and electrically insulated from the substrate.

22. The LED lamp as claimed in claim 21, wherein the LED chip comprises wires connecting the light emitting cells to one another in series.

23. The LED lamp as claimed in claim 21, further comprising a submount interposed between the LED chip and the top portion of the first lead, the submount having electrode patterns corresponding to the light emitting cells,

wherein the light emitting cells are connected to one another in series through the electrode patterns.

24. An LED package, comprising:

a package body;

a submount mounted on the package body and having electrode patterns;

light emitting cells bonded to the electrode patterns of the submount and coupled to one another in series through the electrode patterns; and

an encapsulant or molding member covering the light emitting cells.

25. The LED package as claimed in claim 24, wherein the package body is a printed circuit board with lead electrodes, and the submount is electrically connected to the lead electrodes.

26. The LED package as claimed in claim 24, further comprising:

a pair of lead frames spaced apart from each other; and

a heat sink,

wherein the package body supports the pair of lead frames and the heat sink and has an opening for exposing a portion of each of the lead frames and an upper portion of the heat sink, and the submount is mounted on the heat sink.

27. An LED lamp, comprising:

a first lead having a top portion and a pin-type or snap-type leg extending from the top portion;

a second lead arranged to be spaced apart from the first lead and having a pin-type or snap-type leg corresponding to the first lead;

a submount mounted on the top portion and having electrode patterns;

light emitting cells bonded to the electrode patterns of the submount and coupled to one another in series through the electrode patterns;

bonding wires for connecting the submount to the first and second leads, respectively; and

a molding member for encapsulating the top portion of the first lead, the light emitting cells and a portion of the second lead.