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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

  • US 20090267225A1
  • Filed: 04/24/2009
  • Published: 10/29/2009
  • Est. Priority Date: 04/25/2008
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor integrated circuit between a first layer and a second layer; and

    a first organic layer between the semiconductor integrated circuit and the first layer,wherein the first layer comprises a fibrous body and an organic resin,wherein the second layer comprises a fibrous body and an organic resin, andwherein the first organic layer has a lower modulus of elasticity and higher breaking strength than the first layer and the second layer.

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