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BONDED SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING THE SAME

  • US 20090267233A1
  • Filed: 05/21/2009
  • Published: 10/29/2009
  • Est. Priority Date: 11/04/1996
  • Status: Active Grant
First Claim
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1. A bonded semiconductor structure static random access memory circuit, comprising:

  • a support substrate which carries a first horizontally oriented transistor, and an interconnect region which includes a conductive line; and

    a donor substrate which includes a semiconductor layer stack coupled to a donor substrate body region through a detach region, wherein the semiconductor layer stack is coupled to the interconnect region through a bonding interface, and wherein the semiconductor layer stack includes a pn junction.

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