BRIDGES FOR INTERCONNECTING INTERPOSERS IN MULTI-CHIP INTEGRATED CIRCUITS

• US 20090267238A1
• Filed: 04/28/2008
• Published: 10/29/2009
• Est. Priority Date: 04/28/2008
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Knickerbocker, John Ulrich, Joseph, Douglas James
• Granted Patent: US 8,008,764 B2
• Time in Patent Office: Days
• US Class Current: 257/777
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/17181 On opposite sides of the body
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1433 Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

A structure and a method for forming the same. The structure includes a substrate, a first interposer on the substrate, a second interposer on the substrate, and a first bridge. The first and second interposers are electrically connected to the substrate. The first bridge is electrically connected to the first and second interposers.

Claims

1. A structure, comprising:

a substrate;

a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;

a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate; and

a first bridge electrically connected to the first and second interposers.

2. The structure of claim 1,

wherein the substrate comprises substrate connectors,

wherein the first interposer comprises first interposer connectors,

wherein the second interposer comprises second interposer connectors,

wherein the first and second interposer connectors are electrically connected to the substrate connectors, and

wherein each connector of the substrate connectors, the first interposer connectors, and the second interposer connectors comprises one selected from the group consisting of a solder ball, a pad, and a stud.

3. The structure of claim 2,

wherein the first interposer further comprises first bonding connectors,

wherein the second interposer further comprises second bonding connectors,

wherein the first bridge comprises bridge connectors,

wherein the first and second bonding connectors are in direct physical contact one-to-one with the bridge connectors, and

wherein each connector of the first bonding connectors, the second bonding connectors, and the bridge connectors comprises one selected from the group consisting of a solder ball, a pad, and a stud.

4. The structure of claim 3, further comprising a third interposer on the first interposer,

wherein the third interposer is electrically connected to the first interposer.

5. The structure of claim 4, further comprising a fourth interposer on the first interposer,

wherein the fourth interposer is electrically connected to the first interposer, and

wherein each interposer of the first, second, third, and fourth interposers comprises at least a transistor.

6. The structure of claim 2,

wherein the first interposer further comprises first bonding connectors,

wherein the second interposer further comprises second bonding connectors,

wherein the first bridge comprises bridge connectors,

wherein the first and second bonding connectors are in direct physical contact one-to-one with the bridge connectors, and

wherein each connector of the first bonding connectors, the second bonding connectors, and the bridge connectors comprises one selected from the group consisting of a solder ball, a pad, and a stud.

7. The structure of claim 1, wherein the first bridge is in direct physical contact with the substrate.

8. The structure of claim 7, wherein a first top surface of the substrate and a second top surface of the first bridge are coplanar.

9. The structure of claim 1,

wherein the first bridge comprises bridge connectors,

wherein the first interposer comprises first interposer connectors,

wherein the second interposer comprises second interposer connectors,

wherein the bridge connectors are in direct physical contact one-to-one with the first and second interposer connectors, and

wherein each connector of the first interposer connectors, the second interposer connectors, and the bridge connectors comprises one selected from the group consisting of a solder ball, a pad, and a stud.

10. The structure of claim 9, wherein the first bridge comprises an integrated circuit.

11. The structure of claim 1, further comprising:

a fifth interposer on the substrate, wherein the fifth interposer is electrically connected to the substrate; and

a second bridge electrically connected to the first and fifth interposers.

12. A structure, comprising:

a substrate;

a first interposer on the substrate, wherein the first interposer is electrically connected to the substrate;

a second interposer on the substrate, wherein the second interposer is electrically connected to the substrate; and

a first bridge electrically connected to the first and second interposers,

wherein the substrate comprises substrate connectors,

wherein the first interposer comprises first interposer connectors,

wherein the second interposer comprises second interposer connectors,

wherein the first and second interposer connectors are electrically connected to the substrate connectors,

wherein the first bridge is in direct physical contact with the substrate, and

wherein each connector of the first interposer connectors, the second interposer connectors, and the bridge connectors comprises one selected from the group consisting of a solder ball, a pad, and a stud.

13. The structure of claim 12, further comprising a third interposer on the first interposer,

wherein the third interposer is electrically connected to the first interposer.

14. The structure of claim 13, further comprising a fourth interposer on the first interposer,

wherein the fourth interposer is electrically connected to the first interposer.

15. The structure of claim 12, further comprising:

a fifth interposer on the substrate, wherein the fifth interposer is electrically connected to the substrate; and

a second bridge electrically connected to the first and fifth interposers.

16. A structure formation method, comprising:

providing (i) a substrate, (ii) a first interposer, (iii) a second interposer, and (iv) a bridge; and

attaching the substrate, the first interposer, the second interposer, and the bridge together, wherein the first interposer is electrically connected to the substrate,

wherein the second interposer is electrically connected to the substrate, and

wherein the bridge is electrically connected to the first and second interposers.

17. The method of claim 16, further comprising:

providing a third interposer; and

attaching the third interposer to the first interposer, wherein the third interposer is electrically connected to the first interposer.

18. The method of claim 16, wherein said attaching the substrate, the first interposer, the second interposer, and the bridge together comprises:

attaching the bridge to the substrate;

after said attaching the bridge to the substrate is performed, attaching the first interposer to both the substrate and the bridge; and

after said attaching the bridge to the substrate is performed, attaching the second interposer to both the substrate and the bridge.

19. The method of claim 16, wherein said attaching the substrate, the first interposer, the second interposer, and the bridge together comprises:

attaching the first and second interposers to the substrate; and

after said attaching the first and second interposers to the substrate is performed, attaching the bridge to the first and second interposers.

20. The method of claim 16, wherein the bridge comprises an integrated circuit.