INTELLIGENT PACKAGING METHOD AND SYSTEM BASED ON ACOUSTIC WAVE DEVICES

• US 20090267761A1
• Filed: 04/28/2008
• Published: 10/29/2009
• Est. Priority Date: 04/28/2008
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Cobianu, Cornel, Dumitru, Viorel-Georgel, Georgescu, Ion
• Granted Patent: US 7,755,489 B2
• Time in Patent Office: Days
• US Class Current: 340/540
• CPC Class Codes: B65D 2203/10 Transponders
• CPC Class Codes: G01N 2291/0258 Structural degradation, e.g. fatigue of composites, ageing of oils
• CPC Class Codes: G01N 29/043 in the interior, e.g. by shear waves
• CPC Class Codes: G01N 29/2481 Wireless probes, e.g. with transponders or radio links
• CPC Class Codes: G06K 19/0672 with resonating marks
• CPC Class Codes: G06K 19/0675 the resonating marks being of the surface acoustic wave [SAW] kind SAW devices per se H03H9/64
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07798 part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers electronic seals G09F3/03
• CPC Class Codes: H03H 9/6406 Filters characterised by a particular frequency characteristic

Abstract

An intelligent packaging system utilizing acoustic wave devices includes an electronic module, a SAW ID, various passive SAW sensors and a printed antenna. The passive SAW sensors include a SAW pressure sensor, a SAW temperature sensor and one or more SAW chemical sensors for monitoring physical parameters of a package content. The electronic module generally includes a printed large area distributed electrical circuit, an impedance transformer and a SAW transponder for realizing passive wireless monitoring of the structural integrity of the package. A separate power harvesting antenna and/or a separate dual band antenna can generate radio frequency (RF) power for biasing components associated with the electronic module.

Claims

1. An intelligent package monitoring system, comprising:

an electronic module for tamper monitoring and identification of a package, said electronic module including a distributed electrical circuit printed on a dielectric film capable of being wrapped about said package in a logistic chain, wherein said distributed electrical circuit detects a rupture of said dielectric film through an electrical resistance change of at least one element of said distributed electrical circuit;

a plurality of passive acoustic wave sensors for package identification and monitoring at least one physical parameter of said package content, said plurality of passive acoustic wave sensors capable of electronically communicating with an antenna for wirelessly transmitting a signal; and

at least one acoustic wave interdigital transducer associated with said plurality of passive acoustic wave sensors and said electronic module, wherein said at least one acoustic wave interdigital transducer is capable of power harvesting in order to generate an RF power for biasing said electronic module, and thereby permitting a passive wireless monitoring of a structural integrity of said dielectric film and said package in said logistic chain thereto.

2. The system of claim 1 further comprising:

an impedance transformer and an acoustic wave transponder in association with said electronic module in order to assist in said passive wireless monitoring of said structural integrity of said package.

3. The system of claim 1 wherein said distributed electrical circuit comprises a large area distributed Wheatstone bridge circuit comprising a plurality of bridge arms composed of printed electrically conductive traces.

4. The system of claim 1 further comprising a separate power-harvesting antenna for generating said RF power.

5. The system of claim 1 further comprising a dual band power-harvesting antenna for generating said RF power.

6. The system of claim 1 further comprising a rectifier, a signal processing unit and a driver in association with said impedance transformer.

7. The system of claim 1 wherein said plurality of passive acoustic wave sensors comprise at least one of the following:

a SAW pressure sensor,

a SAW temperature sensor,

a SAW ID associated with said package; and

a plurality of SAW chemical sensors for monitoring a pressure, a temperature and a chemical composition of said package content.

17. The method of claim 1 further comprising providing a separate power-harvesting antenna for generating said RF power.

18. The method of claim 1 further comprising providing a dual band power-harvesting antenna for generating said RF power.

19. The method of claim 1 further comprising providing a rectifier, a signal processing unit and a driver in association with said impedance transformer.

8. An intelligent package monitoring system, comprising:

an electronic module for tamper monitoring and identification of a package, said electronic module including a distributed electrical circuit printed on a dielectric film capable of being wrapped about said package in a logistic chain, wherein said distributed electrical circuit detects a rupture of said dielectric film through an electrical resistance change of at least one element of said distributed electrical circuit;

a plurality of passive acoustic wave sensors for package identification and monitoring at least one physical parameter of said package content, said plurality of passive acoustic wave sensors capable of electronically communicating with an antenna for wirelessly transmitting a signal;

at least one acoustic wave interdigital transducer associated with said plurality of passive acoustic wave sensors and said electronic module, wherein said at least one acoustic wave interdigital transducer is capable of power harvesting in order to generate an RF power for biasing said electronic module, and thereby permitting a passive wireless monitoring of a structural integrity of said dielectric film and said package in said logistic chain thereto; and

an impedance transformer and an acoustic wave transponder in association with said electronic module in order to assist in said passive wireless monitoring of said structural integrity of said package.

9. The system of claim 8 wherein said distributed electrical circuit comprises a large area distributed Wheatstone bridge circuit comprising a plurality of bridge arms composed of printed electrically conductive traces.

10. The system of claim 8 further comprising a separate power-harvesting antenna for generating said RF power.

11. The system of claim 8 further comprising a dual band power-harvesting antenna for generating said RF power.

12. The system of claim 8 further comprising a rectifier, a signal processing unit and a driver in association with said impedance transformer.

13. The system of claim 8 wherein said plurality of passive acoustic wave sensors comprise at least one of the following:

a SAW pressure sensor;

a SAW temperature sensor;

a SAW ID; and

a plurality of SAW chemical sensors for monitoring a pressure, a temperature and a chemical composition of said package content.

14. A method for monitoring a package, comprising:

providing an electronic module for tamper monitoring of said package, said electronic module including a distributed electrical circuit printed on a dielectric film capable of being wrapped about said package in a logistic chain, wherein said distributed electrical circuit detects a rupture of said dielectric film through an electrical resistance change of at least one element of said distributed electrical circuit;

associating a plurality of passive acoustic wave sensors with said electronic module, wherein said plurality of passive acoustic wave sensors is capable of monitoring at least one physical parameter of said package content, said plurality of passive acoustic wave sensors capable of electronically communicating with an antenna for wirelessly transmitting a signal; and

associating at least one acoustic wave interdigital transducer with said plurality of passive acoustic wave sensors and said electronic module, wherein said at least one acoustic wave interdigital transducer is capable of power harvesting in order to generate an RF power for biasing said electronic module, and thereby permitting a passive wireless monitoring of a structural integrity of said dielectric film and said package in said logistic chain thereto.

15. The method of claim 14 further comprising providing an impedance transformer and an acoustic wave transponder in association with said electronic module in order to assist in said passive wireless monitoring of said structural integrity of said package.

16. The method of claim 14 further comprising configuring distributed electrical circuit to include a large area distributed Wheatstone bridge circuit comprising a plurality of bridge arms composed of printed electrically conductive traces.

20. The method of claim 14 further comprising configuring said plurality of passive acoustic wave sensors to include at least one of the following:

a SAW pressure sensor;

a SAW temperature sensor;

a SAW ID; and

a plurality of SAW chemical sensors for monitoring a pressure, a temperature and a chemical composition of said package content.