HEADSET DEVICE

• US 20090268935A1
• Filed: 04/29/2008
• Published: 10/29/2009
• Est. Priority Date: 04/29/2008
• Status: Abandoned Application

• Current Assignee: Outside The Box, Inc.
• Original Assignee: Outside The Box, Inc.
• Inventors: Dillinger, David A.
• Application Number:
  US12/111,685
• Publication Number:
  US 20090268935A1
• Time in Patent Office: Days
• US Class Current: 381/371
• CPC Class Codes: H04R 1/1075 Mountings of transducers in earphones or headphones

Abstract

A headset device comprising first and second headphones interconnected through a headband, wherein each of the first and second headphones comprises an earcup defining a unitary acoustic resonance chamber, a foraminous driver mount positioned offset from both a lateral axis and a longitudinal axis defined by the earcup, and a diaphragm retention ring extending from a surface of the foraminous driver mount. Each of the headphones further comprises a driver mounted within the driver mount and including a diaphragm, a foraminous unitary diaphragm support for maintaining the driver within the driver mount, an earcup cover attached to the earcup, and an earpad attached to the earcup.

Claims

1. A headphone, comprising:

an earcup defining a unitary acoustic resonance chamber, a foraminous driver mount positioned offset from both a lateral axis and a longitudinal axis defined by the earcup, and a diaphragm retention ring extending from a surface of the foraminous driver mount;

a driver mounted within the driver mount and including a diaphragm;

a foraminous unitary diaphragm support for maintaining the driver within the driver mount;

an earcup cover associated with the earcup; and

an earpad associated with the earcup.

2. The headphone according to claim 1, wherein the earcup further defines a battery compartment for receiving at least one battery therein.

3. The headphone according to claim 1, further comprising a buffer board for supporting electronic components and conductive pathways, and wherein the earcup defines a mounting surface for mounting the buffer board thereon, the mounting surface defining a plurality of mounting posts extending from the mounting surface for being received within mounting holes of the buffer board.

4. The headphone according to claim 1, wherein the earcup cover is pivotally attached to the earcup.

5. The headphone according to claim 1, further comprising a jack for receiving a connector of a detachable microphone.

6. The headphone according to claim 1, wherein the unitary acoustic resonance chamber comprises a plurality of smaller chambers interconnected through a plurality of openings defined through walls of the earcup.

7. The headphone according to claim 1, wherein the foraminous unitary diaphragm support is disc-shaped and defines a plurality of openings arranged in a fan-shape radially about a center of the unitary diaphragm support.

8. The headphone according to claim 1, further comprising one of a wired and a wireless connection for operationally connecting the headphone to an electronic device.

9. A headset device, comprising:

a first headphone and a second headphone, each including;

an earcup defining a unitary acoustic resonance chamber, a foraminous driver mount positioned offset from both a lateral axis and a longitudinal axis defined by the earcup, and a diaphragm retention ring extending from a surface of the foraminous driver mount;

a driver mounted within the driver mount and including a diaphragm;

a foraminous unitary diaphragm support for maintaining the driver within the driver mount;

an earcup cover associated with the earcup; and

an earpad associated with the earcup;

a headband for interconnecting the first and second headphones.

10. The headset device according to claim 9, wherein the earcup further defines a battery compartment for receiving at least one battery therein.

11. The headset device according to claim 9, further comprising a buffer board for supporting electronic components and conductive pathways, and wherein the earcup defines a mounting surface for mounting the buffer board thereon, the mounting surface defining a plurality of mounting posts extending from the mounting surface for being received within mounting holes of the buffer board.

12. The headset device according to claim 9, wherein the earcup cover is pivotally attached to the earcup.

13. The headset device according to claim 9, further comprising a jack for receiving a connector of a detachable microphone.

14. The headset device according to claim 9, wherein the unitary acoustic resonance chamber comprises a plurality of chambers interconnected through a plurality of openings defined through walls of the earcup.

15. The headset device according to claim 9, wherein the foraminous unitary diaphragm support is disc-shaped and defines a plurality of openings arranged in a fan-shape radially about a center of the unitary diaphragm support.

16. The headset device according to claim 9, further comprising one of a wired and a wireless connection for operationally connecting the headphone to an electronic device.

17. A headset device, comprising:

an earcup defining a unitary acoustic resonance chamber comprising a plurality of smaller chambers interconnected through a plurality of openings defined within walls of the earcup;

a driver mount defined by the earcup and positioned offset with respect to a longitudinal axis and a lateral axis defined by the ear cup, the driver mount defining a surface and a plurality of openings defined within the surface;

a diaphragm retention ring extending from the surface of the driver mount; and

a foraminous unitary diaphragm support for supporting a driver within the driver mount.

18. The headset device according to claim 17, further comprising a buffer board mounting surface defined by the ear cup for mounting a buffer board thereon.

19. The headset device according to claim 17, further comprising a battery compartment defined by the earcup for receiving at least one battery therein.

20. The headset device according to claim 17, further comprising an earcup cover pivotally attached to the earcup.