LEAD CONDITION ASSESSMENT FOR AN IMPLANTABLE MEDICAL DEVICE

• US 20090270959A1
• Filed: 07/07/2009
• Published: 10/29/2009
• Est. Priority Date: 10/28/2005
• Status: Active Grant

• Current Assignee: LivaNova USA, Inc. (LivaNova Plc)
• Original Assignee: Cyberonics, Inc
• Inventors: Armstrong, Randolph K.
• Granted Patent: US 8,190,258 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/3614 based on impedance measurement
• CPC Class Codes: A61N 1/36142 for improving safety
• CPC Class Codes: A61N 1/36521 the parameter being derived from measurement of an electrical impedance
• CPC Class Codes: A61N 1/3706 Pacemaker parameters stimulation threshold A61N1/371
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents

Abstract

A method, system, and apparatus for performing a lead condition assessment and/or a lead orientation determination associated with an implantable medical device (IMD). A first impedance is determined. The first impedance relates to the impedance relative to a first electrode and a portion of the IMD. A second impedance is determined. The second impedance relates to the impedance relative to a second electrode and the portion of the IMD. The first impedance is compared with the second impedance to determine an impedance difference. A determination is made whether the impedance difference is outside a predetermined tolerance range. Furthermore, artifact measured during impedance measurements or test pulses may be compared to assess lead orientation. An indication of a lead condition error is provided in response to determining that the impedance difference is outside the predetermined tolerance range.

Claims

1-13. -13. (canceled)

14. A method for determining a condition of a lead assembly associated with an implantable medical device (IMD), comprising:

providing a first test signal to a first electrode coupled to the IMD;

measuring a first signal artifact relating to a second electrode coupled to the IMD, the first signal artifact resulting from the first test signal being applied to the first electrode;

providing a second test signal to the second electrode;

measuring a second signal artifact relating to the first electrode, the second signal artifact resulting from the second test signal being applied to the second electrode;

comparing the first signal artifact to the second signal artifact to determine a signal artifact differential; and

determining a lead condition in response to the signal artifact differential.

15-21. -21. (canceled)