ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME

• US 20090272567A1
• Filed: 08/04/2008
• Published: 11/05/2009
• Est. Priority Date: 05/01/2008
• Status: Abandoned Application

• Current Assignee: Advanced Connection Technology Company Limited
• Original Assignee: Advanced Connection Technology Company Limited
• Inventors: Wang, Ching-Shun, HSIA, Chun-Hua, Wang, Ming-Chung
• Application Number:
  US12/185,299
• Publication Number:
  US 20090272567A1
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/81345 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/81385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2201/209 Auto-mechanical connection between a component and a PCB or between two PCBs
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/4007 Surface contacts, e.g. bumps H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3457
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An electronic device includes: first and second electronic parts, each of which has a conductive contact; and a plurality of first and second conductive filaments formed on the conductive contacts of the first and second electronic parts, respectively. The first and second electronic parts are connected detachably and coupled electrically to each other through interlocking between the first and second conductive filaments.

Claims

1. An electronic device comprising:

first and second electronic parts, each of which has a conductive contact; and

a plurality of first and second conductive filaments formed on said conductive contacts of said first and second electronic parts, respectively;

wherein said first and second electronic parts are connected detachably and coupled electrically to each other through interlocking between said first and second conductive filaments.

2. The electronic device of claim 1, wherein each of said first and second conductive filaments has a core and a metal sheath enclosing said core.

3. The electronic device of claim 1, wherein said first and second conductive filaments interlock with each other in a hook-and-loop engaging manner.

4. The electronic device of claim 1, wherein each of said first and second conductive filaments has a nanoscale cross-section.

5. The electronic device of claim 1, wherein said first electronic part is a printed circuit board.

6. The electronic device of claim 5, wherein said second electronic part is a semiconductor chip.

7. A method for bonding two electronic parts comprising:

(a) forming a plurality of first conductive filaments on one of the electronic parts, and a plurality of second conductive filaments on the other of the electronic parts; and

(b) attaching the first conductive filaments to the second conductive filaments so that the electronic parts are connected detachably and coupled electrically to each other through interlocking between the first and second conductive filaments.

8. The method of claim 7, wherein formation of the first and second conductive filaments in step (a) is conducted through semiconductor fabrication techniques.