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Athmosphere-Controlled Bonding Apparatus, Bonding Method, and Electronic Device

  • US 20090272721A1
  • Filed: 09/28/2005
  • Published: 11/05/2009
  • Est. Priority Date: 09/28/2005
  • Status: Abandoned Application
First Claim
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1. A bonding apparatus for electrically bonding under pressure a bonding metal terminal and a to-be-bonded metal terminal to each other, characterized in that a water concentration in an atmosphere in a pressure-bonding portion is set smaller than that in an atmosphere outside the apparatus.

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