Encapsulation for phosphor-converted white light emitting diode
First Claim
1. A light emitting diode (LED) device, comprising:
- an LED chip;
a conversion layer disposed on said LED chip, said conversion layer having a binder material and a plurality of phosphor particles dispersed throughout said binder material;
a plurality of nanoparticles disposed proximate to said LED chip; and
a plurality of light scattering particles disposed proximate to said LED chip.
3 Assignments
0 Petitions
Accused Products
Abstract
An improved light emitting device, especially a phosphor-converted white light device, wherein the light extraction efficiency and the color temperature distribution uniformity are improved by the introduction of both nanoparticles and light scattering particles proximate to the light source. Nanoparticles having a high index of refraction are dispersed throughout a wavelength conversion layer to adjust the index of refraction of the layer for improved light extraction. Light scattering particles may be dispersed in the wavelength conversion layer and/or in a surrounding medium to improve the spatial correlated color temperature uniformity.
245 Citations
58 Claims
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1. A light emitting diode (LED) device, comprising:
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an LED chip; a conversion layer disposed on said LED chip, said conversion layer having a binder material and a plurality of phosphor particles dispersed throughout said binder material; a plurality of nanoparticles disposed proximate to said LED chip; and a plurality of light scattering particles disposed proximate to said LED chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A light emitting diode (LED) device, comprising:
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an LED chip disposed on a mount surface, said LED chip having a textured primary emission surface; a wavelength conversion layer disposed on said LED chip, said conversion layer comprising; a binder material having a first refractive index; a plurality of phosphor particles dispersed throughout said binder material; and a plurality of nanoparticles dispersed throughout said binder material; and a plurality of light scattering particles arranged proximate to said LED chip. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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43. A method of manufacturing a plurality of light emitting diode (LED) devices, comprising:
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growing a plurality of LED devices on a semiconductor wafer; applying a wavelength conversion layer on said wafer such that each of said LED devices is covered by said conversion layer, said conversion layer comprising a plurality of nanoparticles dispersed throughout said conversion layer; and arranging a plurality of light scattering particles proximate to said LED devices. - View Dependent Claims (44, 45, 46)
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47. A light emitting diode (LED) device, comprising:
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an LED chip disposed on a mount surface, said LED chip having a textured primary emission surface; a wavelength conversion layer disposed on said LED chip, said conversion layer comprising; a binder material having a first refractive index; a plurality of phosphor particles dispersed throughout said binder material; wherein said phosphor particles have a diameter of less than 10 nanometers or greater than 10 micrometers; and a plurality of light scattering particles arranged proximate to said LED chip. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58)
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Specification