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Encapsulation for phosphor-converted white light emitting diode

  • US 20090272996A1
  • Filed: 05/02/2008
  • Published: 11/05/2009
  • Est. Priority Date: 05/02/2008
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED) device, comprising:

  • an LED chip;

    a conversion layer disposed on said LED chip, said conversion layer having a binder material and a plurality of phosphor particles dispersed throughout said binder material;

    a plurality of nanoparticles disposed proximate to said LED chip; and

    a plurality of light scattering particles disposed proximate to said LED chip.

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