FLEXIBLE DEVICE, FLEXIBLE PRESSURE SENSOR, AND FABRICATION METHOD THEREOF

• US 20090273909A1
• Filed: 05/05/2009
• Published: 11/05/2009
• Est. Priority Date: 09/10/2004
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: SHIN, Kyu-ho, MOON, Chang-youl, KIM, Yong-jun
• Granted Patent: US 8,107,248 B2
• Time in Patent Office: Days
• US Class Current: 361/749
• CPC Class Codes: G01L 19/146 using flexible element between the transducer and the support
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/30105 Capacitance
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H05K 1/185 Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence

Abstract

A flexible device, a flexible pressure sensor, and a fabrication method thereof. The present flexible device includes: a first flexible substrate formed of a flexible material to have a flexibility; an active element formed to have a predetermined thickness and a flexibility, and being attached on the first flexible substrate; and a second flexible substrate formed of a flexible material to have a flexibility, and being deposited on the active element. The flexible device and the flexible pressure sensor have a high flexibility, so that they may be applied for a medical treatment such as implantation to a living body, a human body and so forth. In addition, the flexible device has a high flexibility, so that it may be inserted to a curved surface, which contributes to remove the limit of space where the semiconductor package device may be inserted.

Claims

1. A flexible pressure sensor, comprising:

a flexible substrate formed of a flexible material to have a flexibility, and allowing a circular shape to be formed when it is bent;

a first electrode formed in one surface of the flexible substrate;

a second electrode formed in the one surface of the flexible substrate, and facing the first electrode to form a capacitor when the flexible substrate is formed to have the circular shape; and

a coil formed in the other surface of the flexible substrate, and forming a resonance circuit electrically connected to a capacitor formed by the first and second electrodes, and outputting a signal corresponding to a resonance frequency which changes in response to a change of a capacitance between the first electrode and the second electrode.

2. The flexible pressure sensor as claimed in claim 1, wherein the capacitance between the first electrode and the second electrode changes in response to a change of a diameter of a material interposed between the first electrode and the second electrode.

3. The flexible pressure sensor as claimed in claim 2, wherein the interposed material is a blood vessel.

4. The flexible pressure sensor as claimed in claim 1, further comprising:

another flexible substrate formed of a flexible material to have a flexibility, allowing a circular shape to be formed when it is bent, and being deposited on the coil.

5. The flexible pressure sensor as claimed in claim 1, wherein the flexible substrate is formed of a flexible high molecular material.

6. The flexible pressure sensor as claimed in claim 5, wherein the high molecular material is polyimide.

7. The flexible pressure sensor as claimed in claim 1, wherein the first and second electrodes are formed of gold (Au).

8. The flexible pressure sensor as claimed in claim 1, wherein the coil is formed of copper (Cu).