SINGLE BEAM OPTICAL APPARATUS AND METHOD

• US 20090274191A1
• Filed: 04/22/2009
• Published: 11/05/2009
• Est. Priority Date: 04/22/2008
• Status: Abandoned Application

• Current Assignee: Alain Hache, Michel Deveau
• Original Assignee: Alain Hache, Michel Deveau
• Inventors: Deveau, Michel, Hache, Alain
• Application Number:
  US12/428,001
• Publication Number:
  US 20090274191A1
• Time in Patent Office: Days
• US Class Current: 374/43
• CPC Class Codes: G01K 11/00 Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
• CPC Class Codes: G01N 25/18 by investigating thermal conductivity by calorimetry G01N25/20; by measuring change of resistance of an electrically-heated body G01N27/18

Abstract

A single-beam optical apparatus suitable for measuring thermal diffusivity of a sample having a laser source generating a focused laser beam capable of heating a portion of the sample so as to create a thermal bump via thermal dilation, the thermal bump reflecting a reflected portion of the focused laser beam, means for modulating the intensity of the laser beam, an aperture, a sensor positioned relative to the reflected portion of the focused laser beam so as to generate a measured signal from the reflected portion of the focused laser beam that passes through the aperture, and a module for determining at least the parameters of a relationship between a property of the thermal bump and the measured signal.

Claims

1. A single-beam optical apparatus suitable for measuring thermal diffusivity of a sample, the apparatus comprising:

a laser source generating a focused laser beam capable of heating a portion of the sample so as to create a thermal bump via thermal dilation, the thermal bump reflecting a reflected portion of the focused laser beam;

means for modulating the intensity of the laser beam;

an aperture;

a sensor positioned relative to the reflected portion of the focused laser beam so as to generate a measured signal from the reflected portion of the focused laser beam that passes through the aperture; and

a module for determining at least the parameters of a relationship between a property of the thermal bump and the measured signal.

2. The apparatus as recited in claim 1, further comprising a thin film sandwiched between the sample and a substrate.

3. The apparatus as recited in claim 2, wherein the thin film comprises a partially absorbing material.

4. The apparatus as recited in claim 2, wherein the metal is chromium or beryllium.

5. The apparatus as recited in claim 1, wherein the sensor comprises a photodiode and an aperture positioned between the thermal bump and the photodiode, so that light goes through the aperture to the photodiode according to a substantially linear function of the height of the thermal bump, whereby as the reflected portion of the focused laser beam diverges as a result of the thermal bump height increasing, less light goes through the aperture and the signal at the photodiode drops.

6. The apparatus as recited in claim 1, wherein the relationship between a property of the thermal bump and the measured signal is substantially s=A(1−

Bh), wherein the measured signal is s, the property of the thermal bump is a height of the thermal bump h, and A and B are the parameters of the relationship which are at least determined by the module, so that the module can further determine the height of the thermal bump from the measured signal.

7. The apparatus as recited in claim 1, wherein the relationship between a property of the thermal bump and the measured signal is substantially s=C(1−

Dh), wherein the measured signal is s, the property of the thermal bump is a temperature of the thermal bump T, and C and D are the parameters of the relationship which are at least determined by the module, so that the module can further determine the temperature of the thermal bump from the measured signal.

8. The apparatus as recited in claim 1, wherein the parameters of the relationship which are at least determined by the module are determined as a function of experimental arrangements by calibration as a function of at least one of the focused laser beam spot size, a position of the sample, and the width of an aperture.

9. The apparatus as recited in claim 1, wherein the sample is one of a solid or a liquid.

10. The apparatus as recited in claim 1, wherein the sample is one of opaque or transparent.

11. The apparatus as recited in claim 1, wherein the module further determines the thermal diffusivity of the sample as a function of the time evolution of the relationship between the property of the thermal bump and the measured signal.

12. A single-beam optical method suitable for measuring thermal diffusivity of a sample, the method comprising the steps of:

(a) generating a focused laser beam;

(b) modulating the laser beam;

(c) heating a portion of the sample using the focused laser beam;

(d) creating a thermal bump via thermal dilation as a result of the heating step;

(e) reflecting a reflected portion of the focused laser beam off of the thermal bump;

(f) generating a measured signal from the reflected portion of the focused laser beam; and

(g) determining at least the parameters of a relationship between a property of the thermal bump and the measured signal.

13. The method as recited in claim 12, further comprising the step of providing a thin film sandwiched between the sample and a substrate.

14. The method as recited in claim 13, wherein the thin film comprises at least one of chromium or beryllium.

15. The method as recited in claim 12, further comprising the step of determining the divergence of the reflected portion of the focused laser beam that occurs as a result of the thermal bump height increasing.

16. The method as recited in claim 12, wherein the relationship between a property of the thermal bump and the measured signal is substantially s=A(1−

Bh), wherein the measured signal is s, the property of the thermal bump is a height of the thermal bump h, and A and B are the parameters of the relationship which are at least determined by the module, so that the module can further determine the height of the thermal bump from the measured signal.

17. The method as recited in claim 12, wherein the relationship between a property of the thermal bump and the measured signal is substantially s=C(1−

DT), wherein the measured signal is s, the property of the thermal bump is a temperature of the thermal bump T, and C and D are the parameters of the relationship which are at least determined by the module, so that the module can further determine the temperature of the thermal bump from the measured signal.

18. The method as recited in claim 12, wherein the step of determining at least the parameters of a relationship between a property of the thermal bump and the measured signal comprises the act of simulating thermal diffusion driven by laser heating.

19. The method as recited in claim 18, wherein the act of simulating thermal diffusion driven by laser heating uses the finite difference algorithm.

20. The method as recited in claim 18, wherein the act of simulating thermal diffusion driven by laser heating uses a model for the single-beam laser and sample.

21. The method as recited in claim 16, wherein the estimator for the heat transfer equation includes a power per unit volume term which assumes that the laser beam transfers its energy at the substrate surface according to a radial Gaussian distribution.

22. The method as recited in claim 12, wherein the parameters of the relationship which are at least determined by the module are determined as a function of experimental arrangements by calibration as a function of at least one of the focused laser beam spot size, a position of the sample, and the width of an aperture.

23. The method as recited in claim 12, wherein the sample is one of a solid and a liquid.

24. The method as recited in claim 12, wherein the sample is opaque or transparent.

25. The method as recited in claim 12, further comprising the step of determining the thermal diffusivity of the sample as a function of the time evolution of the relationship between the property of the thermal bump and the measured signal.