LIGHT MODULE PACKAGE

• US 20090278034A1
• Filed: 09/20/2007
• Published: 11/12/2009
• Est. Priority Date: 10/05/2006
• Status: Active Grant

• Current Assignee: Koninklijke Philips N.V.
• Original Assignee: Koninklijke Philips N.V.
• Inventors: Hilgers, Achim, Bechtel, Hans-Helmut, Ackermann, Bernd, Wendt, Matthias
• Granted Patent: US 7,947,947 B2
• Time in Patent Office: Days
• US Class Current: 250/227.110
• CPC Class Codes: G02F 1/355 characterised by the materials used
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/02322 comprising luminescent members, e.g. fluorescent sheets upon the device
• CPC Class Codes: H01L 31/173 formed in, or on, a common substrate
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil

Abstract

The invention relates to a mounting substrate (10) for mounting and electrically contacting at least one light emitting diode (20), a ceramic layer (40) disposed in a path of light emitted by the light emitting diode (20), wherein the ceramic layer (40) comprises a wavelength converting material, the light emitting diode (20) disposed between the ceramic layer (40) and the mounting substrate (10), a light sensor (30) disposed at the mounting substrate (10) detecting a luminous output of the light emitting diode (20) in order to control the brightness and/or the color of the light leaving the light module (1), wherein the ceramic layer (40) is only partly translucent to shield the light sensor (30) against ambient light.

Claims

1. A light module package comprising:

at least one light emitting diode;

a mounting substrate for mounting and electrically contacting the at least one light emitting diode,

a ceramic layer comprising a wavelength converting material and disposed in a path of light emitted by the light emitting diode

a light sensor disposed at the mounting substrate and having a sensitive area for detecting a luminous output of the light emitting diode wherein

the sensitive area directly faces the ceramic layer and

the ceramic layer is only partly translucent to shield the light sensor against ambient light.

2. A light module package as claimed in claim 1, wherein the light sensor is integrated into the mounting substrate.

3. A light module package as claimed in claim 1 wherein the ceramic layer comprises a light guide directed to the light sensor.

5. A light module package as claimed in claim 3, wherein the light guide extends to the light sensor.

6. A light module package as claimed in claim 1, wherein the ceramic layer comprises a reflecting layer for providing an additional shielding against ambient light.

7. A light module package as claimed in claim 6, wherein the ceramic layer has a top face and a bottom face (43), wherein the bottom face (43) is directed to the mounting substrate, wherein the reflecting layer is disposed on the top face.

8. A light module package as claimed in claim 1, further comprising a temperature sensor disposed at the mounting substrate for measuring the temperature of the light emitting diode and/or of the light sensor.

9. A light module package as claimed in claim 1, wherein the ceramic layer comprises a rigid agglomerate of phosphor particles.

12. A light module package as claimed in claim 1, wherein the light sensor is disposed adjacent to the ceramic layer.

4. (canceled)

10-11. -11. (canceled)