LIGHT-EMITTING DIODE PACKAGE ASSEMBLY
First Claim
1. An electrical device, comprising:
- a plurality of light emitting diode (LED) dies each having respective first connectors and second connectors that are suitable for receiving electrical current through respective of said LED dies;
a common base layer of a first electrically conductive material having a plurality of cavities into which at least one of said plurality of LED dies is mounted such that said second connectors are electrically connected by a conductive bonding material to said first conductive material of said base layer;
at least one over-layer section of a second electrically conductive material wherein each said over-layer is electrically connected by a bond to at least one of said first connectors of said LED dies; and
an insulator electrically separating said first conductive material of said base layer from said second conductive material of said at least one over-layer section.
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Accused Products
Abstract
An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections.
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Citations
23 Claims
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1. An electrical device, comprising:
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a plurality of light emitting diode (LED) dies each having respective first connectors and second connectors that are suitable for receiving electrical current through respective of said LED dies; a common base layer of a first electrically conductive material having a plurality of cavities into which at least one of said plurality of LED dies is mounted such that said second connectors are electrically connected by a conductive bonding material to said first conductive material of said base layer; at least one over-layer section of a second electrically conductive material wherein each said over-layer is electrically connected by a bond to at least one of said first connectors of said LED dies; and an insulator electrically separating said first conductive material of said base layer from said second conductive material of said at least one over-layer section. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A process to assemble an electrical device comprising a plurality of light emitting diode (LED) dies each having respective first connectors and second connectors that are suitable for receiving electrical current through respective of the LED dies, the process comprising:
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providing a common base layer of a first electrically conductive material surmounted by an insulator in turn surmounted by at least one over-layer section of a second electrically conductive material; making a plurality of cavities each extending through one of said at least one over-layer section and further through said insulator and into said base layer; mounting at least one of the plurality of LED dies into each of said plurality of cavities with a conductive bonding material electrically connecting the second connectors of the LED dies to said first conductive material of said base layer; and bonding the first connectors of the LED dies electrically each to a said at least one over-layer section. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A process to assemble an electrical device comprising a plurality of light emitting diode (LED) dies each having respective first connectors and second connectors that are suitable for receiving electrical current through respective of the LED dies, the process comprising:
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providing a common base layer of a first electrically conductive material wherein said base layer has a principle side; making a plurality of cavities in said principle side of said base layer; mounting at least one of the plurality of LED dies into each of said plurality of cavities with a conductive bonding material electrically connecting the second connectors of the LED dies to said first conductive material of said base layer; providing an insulator over said principle side of said base layer except at said plurality of cavities; providing at least one over-layer section of a second electrically conductive material over said principle side of said base layer except at said plurality of cavities; and bonding the first connectors of the LED dies each electrically to a said at least one over-layer section. - View Dependent Claims (19, 20, 21, 22, 23)
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Specification