MOLDED CHIP FABRICATION METHOD AND APPARATUS
First Claim
1. A light emitting diode (LED), comprising:
- a plurality of semiconductor layers;
a top contact in electrical contact with and extending up from said semiconductors layers; and
a coating comprising a cured binder and a conversion material covering and conforming to said semiconductor layers, said contact extending up through said coating and exposed at the top surface of said coating for electrical contact.
2 Assignments
0 Petitions
Accused Products
Abstract
A light emitting diode (LED) is disclosed comprising a plurality of semiconductor layers with a first contact on the bottom surface of the semiconductor layers and a second contact on the top surface of the semiconductor layer. A coating is included that comprises a cured binder and a conversion material that at least partially covers the semiconductor layers, wherein the second contact extends through the coating and is exposed on the same plane as the top surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light. In other embodiments first and second contacts are accessible from one side of the LED. A coating is included that comprises a cured binder and a conversion material. The coating at least partially covers the semiconductor layers, with the first and second contacts extending through the coating and exposed on the same plane as a surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light.
106 Citations
25 Claims
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1. A light emitting diode (LED), comprising:
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a plurality of semiconductor layers; a top contact in electrical contact with and extending up from said semiconductors layers; and a coating comprising a cured binder and a conversion material covering and conforming to said semiconductor layers, said contact extending up through said coating and exposed at the top surface of said coating for electrical contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A light emitting diode (LED), comprising:
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a plurality of semiconductor layers; a first contact on the bottom surface of said semiconductor layers; a second contact on the top surface of said semiconductor layer; and a coating comprising a cured binder and a conversion material that at least partially covers said semiconductor layers, wherein said second contact extends through said coating and is exposed on the same plane as said top surface of said coating, such that an electrical signal applied to said first and second contacts is conducted through said coating to said semiconductor layers causing said LED to emit light. - View Dependent Claims (12, 13, 14, 15)
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16. A light emitting diode (LED), comprising:
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a plurality of semiconductor layers; a top contact on said semiconductor layers; and a coating comprising a cured binder and a conversion material that at least partially covers said semiconductor layers, said coating having a planar top surface, said top contact extending through said coating and exposed at the same plane as said top surface of said coating by controlling the thickness of said coating over said semiconductor layers. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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23. A light emitting diode (LED), comprising:
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a plurality of semiconductor layers having lateral geometry; a first and second contact accessible from one side of said LED; and a coating comprising a cured binder and a conversion material that at least partially covers said semiconductor layers, wherein said first and second contact extends through said coating and are exposed on the same plane as a surface of said coating, such that an electrical signal applied to said first and second contacts is conducted through said coating to said semiconductor layers causing said LED to emit light. - View Dependent Claims (24, 25)
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Specification