METHODS OF FABRICATING A DEVICE STRUCTURE FOR USE AS A MEMORY CELL IN A NON-VOLATILE RANDOM ACCESS MEMORY
First Claim
1. A method for forming a non-volatile random access memory on an insulating layer, the method comprising:
- forming first and second semiconductor bodies on the insulating layer that have a separated, juxtaposed relationship;
doping the first semiconductor body to form a source and a drain separated by a channel;
partially removing the second semiconductor body to define a floating gate electrode adjacent to the channel of the first semiconductor body;
forming a first dielectric layer between the channel of the first semiconductor body and the floating gate electrode;
forming a second dielectric layer on a top surface of the floating gate electrode; and
forming a control gate electrode on the second dielectric layer that cooperates with the floating gate electrode to control carrier flow in the channel in the first semiconductor body.
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Abstract
Methods for fabricating a device structure for use as a memory cell in a non-volatile random access memory. The method includes forming first and second semiconductor bodies on the insulating layer that have a separated, juxtaposed relationship, doping the first semiconductor body to form a source and a drain, and partially removing the second semiconductor body to define a floating gate electrode adjacent to the channel of the first semiconductor body. The method further includes forming a first dielectric layer between the channel of the first semiconductor body and the floating gate electrode, forming a second dielectric layer on a top surface of the floating gate electrode, and forming a control gate electrode on the second dielectric layer that cooperates with the floating gate electrode to control carrier flow in the channel in the first semiconductor body.
15 Citations
7 Claims
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1. A method for forming a non-volatile random access memory on an insulating layer, the method comprising:
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forming first and second semiconductor bodies on the insulating layer that have a separated, juxtaposed relationship; doping the first semiconductor body to form a source and a drain separated by a channel; partially removing the second semiconductor body to define a floating gate electrode adjacent to the channel of the first semiconductor body; forming a first dielectric layer between the channel of the first semiconductor body and the floating gate electrode; forming a second dielectric layer on a top surface of the floating gate electrode; and forming a control gate electrode on the second dielectric layer that cooperates with the floating gate electrode to control carrier flow in the channel in the first semiconductor body. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification