×

Topography reduction and control by selective accelerator removal

  • US 20090280649A1
  • Filed: 08/06/2007
  • Published: 11/12/2009
  • Est. Priority Date: 10/20/2003
  • Status: Active Grant
First Claim
Patent Images

1. A method of conducting localized liquid treating of an integrated circuit substrate having an exposed substrate surface, comprising processes of:

  • contacting a treating area of said substrate surface with a treating liquid, said treating area being substantially less than said exposed substrate surface;

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×