FLOWABLE DIELECTRIC EQUIPMENT AND PROCESSES
First Claim
1. A method of depositing and curing a dielectric material on a substrate, the method comprising the steps of:
- providing a processing chamber partitioned into a first plasma region and a second plasma region;
delivering the substrate to the processing chamber, wherein the substrate occupies a portion of the second plasma region;
forming a first plasma in the first plasma region, wherein the first plasma does not directly contact with the substrate;
depositing the dielectric material on the substrate to form a dielectric layer, wherein one or more reactants excited by the first plasma are used in the deposition of the dielectric material; and
curing the dielectric layer by forming a second plasma in the second plasma region, wherein one or more carbon-containing species is removed from the dielectric layer.
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Accused Products
Abstract
Methods of depositing and curing a dielectric material on a substrate are described. The methods may include the steps of providing a processing chamber partitioned into a first plasma region and a second plasma region, and delivering the substrate to the processing chamber, where the substrate occupies a portion of the second plasma region. The methods may further include forming a first plasma in the first plasma region, where the first plasma does not directly contact with the substrate, and depositing the dielectric material on the substrate to form a dielectric layer. One or more reactants excited by the first plasma are used in the deposition of the dielectric material. The methods may additional include curing the dielectric layer by forming a second plasma in the second plasma region, where one or more carbon-containing species is removed from the dielectric layer.
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Citations
13 Claims
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1. A method of depositing and curing a dielectric material on a substrate, the method comprising the steps of:
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providing a processing chamber partitioned into a first plasma region and a second plasma region; delivering the substrate to the processing chamber, wherein the substrate occupies a portion of the second plasma region; forming a first plasma in the first plasma region, wherein the first plasma does not directly contact with the substrate; depositing the dielectric material on the substrate to form a dielectric layer, wherein one or more reactants excited by the first plasma are used in the deposition of the dielectric material; and curing the dielectric layer by forming a second plasma in the second plasma region, wherein one or more carbon-containing species is removed from the dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of depositing a film on a substrate disposed in a processing chamber comprising:
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flowing a first process gas mixture into a substrate processing region to form a film on the substrate; and flowing a treatment gas through a plasma, through a showerhead and into the substrate processing region to remove undesirable components from the film during growth. - View Dependent Claims (9)
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10. A method of cleaning an interior surface of a processing chamber comprising:
flowing a treatment gas through a plasma, through a showerhead and into a substrate processing region to remove undesirable components from the interior surface of the processing chamber. - View Dependent Claims (11)
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12. A method of cleaning interior surfaces of a processing chamber partitioned by a showerhead into a first plasma region and a second plasma region, the method comprising:
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flowing a treatment gas into the first plasma region; igniting a plasma in the first plasma region; and igniting a plasma in the second plasma region. - View Dependent Claims (13)
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Specification