Integrated multi-axis micromachined inertial sensing unit and method of fabrication
First Claim
1. An inertial sensing unit, comprising:
- micromachined angular rate and acceleration sensors formed on at least one MEMS die, a single application specific integrated circuit (ASIC) die with operating circuitry for all of the sensors, the MEMS and ASIC dice being stacked together with at least one of the dice on top of another, electrical connections between the angular rate and acceleration sensors and the circuitry on the ASIC die, and a single package enclosing the stacked dice.
1 Assignment
0 Petitions
Accused Products
Abstract
Integrated micromachined inertial sensing unit with multi-axis angular rate and acceleration sensors and method of fabricating the same. Micromachined angular rate and acceleration sensors are integrated together with an application-specific integrated circuit (ASIC) in one compact package. The ASIC combines many separate functions required to operate multiple rate sensors and accelerometers into a single chip. The MEMS sensing elements and the ASIC are die-stacked, and electrically connected either directly using ball-grid-arrays or wirebonding. Through the use of a single package and single ASIC for multiple angular rate and acceleration sensors, significant reduction in cost is achieved.
-
Citations
19 Claims
-
1. An inertial sensing unit, comprising:
- micromachined angular rate and acceleration sensors formed on at least one MEMS die, a single application specific integrated circuit (ASIC) die with operating circuitry for all of the sensors, the MEMS and ASIC dice being stacked together with at least one of the dice on top of another, electrical connections between the angular rate and acceleration sensors and the circuitry on the ASIC die, and a single package enclosing the stacked dice.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
9. An inertial sensing unit, comprising:
- a micromachined angular rate sensor and an acceleration sensor formed on a hermetically encapsulated MEMS die, a single application specific integrated circuit (ASIC) die with operating circuitry for both the angular rate sensor and the acceleration sensor, the MEMS die being stacked on top of the ASIC die with the sensors on the MEMS die being interconnected electrically with the circuitry on the ASIC die, and a single package enclosing the stacked dice.
- View Dependent Claims (10, 11)
-
12. An inertial sensing unit, comprising:
- a micromachined angular rate sensor on a first hermetically encapsulated MEMS die, an acceleration sensor on a second hermetically encapsulated MEMS die, a single application specific integrated circuit (ASIC) die with operating circuitry for both the angular rate sensor and the acceleration sensor, the MEMS dice being stacked on top of the ASIC die with the sensors on the MEMS dice being interconnected electrically with the circuitry on the ASIC die, and a single package enclosing the stacked dice.
- View Dependent Claims (13, 14, 15)
-
16. A method of fabricating an inertial sensing unit, comprising the steps of:
- forming angular rate and acceleration sensors on at least one MEMS die, stacking each MEMS die on top of a single application specific integrated circuit (ASIC) die with operating circuitry for all of sensors, interconnecting the sensors on each MEMS die with the circuitry on the ASIC die, and packaging the stacked dice in a single package.
- View Dependent Claims (17, 18, 19)
Specification