WIDE BAND GAP SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
First Claim
1. A wide band gap semiconductor device comprising:
- a first conductivity type semiconductor substrate having a high impurity concentration;
a first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate and formed on one principal surface of the semiconductor substrate;
a second conductivity type base layer having a higher impurity concentration than the drift layer and formed on the drift layer; and
a first conductivity type source region selectively disposed on a principal surface of the base layer;
a first trench having a depth extending from a principal surface of the source region to reach the drift layer;
a control electrode which is filled through a gate insulating film in the first trench so as to be located in a position facing the source region, the base layer and the drift layer;
a second trench provided near the first trench and having a depth extending from the principal surface of the base layer to reach the drift layer so as to be same depth as or deeper than the first trench;
a first main electrode which is disposed in the second trench to form a Schottky junction between the first main electrode and a surface of the drift layer located in the second trench so that the first main electrode covers the principal surface of the source region and the principal surface of the base layer in common; and
a second main electrode which is disposed on the other principal surface of the first conductivity type semiconductor substrate.
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Accused Products
Abstract
A wide band gap semiconductor device is disclosed. A first trench in a gate electrode part and a second trench in a source electrode part (Schottky diode part) are disposed so that the first and second trenches are close to each other while and the second trench is deeper than the first trench. A metal electrode is formed in the second trench to form a Schottky junction on a surface of an n-type drift layer in the bottom of the second trench. Further, a p+-type region is provided in part of the built-in Schottky diode part being in contact with the surface of the n-type drift layer, preferably in the bottom of the second trench. The result is a wide band gap semiconductor device which is small in size and low in on-resistance and loss, and in which electric field concentration applied on a gate insulating film is relaxed to suppress lowering of withstand voltage to thereby increase avalanche breakdown tolerance at turning-off time.
71 Citations
18 Claims
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1. A wide band gap semiconductor device comprising:
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a first conductivity type semiconductor substrate having a high impurity concentration; a first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate and formed on one principal surface of the semiconductor substrate; a second conductivity type base layer having a higher impurity concentration than the drift layer and formed on the drift layer; and a first conductivity type source region selectively disposed on a principal surface of the base layer; a first trench having a depth extending from a principal surface of the source region to reach the drift layer; a control electrode which is filled through a gate insulating film in the first trench so as to be located in a position facing the source region, the base layer and the drift layer; a second trench provided near the first trench and having a depth extending from the principal surface of the base layer to reach the drift layer so as to be same depth as or deeper than the first trench; a first main electrode which is disposed in the second trench to form a Schottky junction between the first main electrode and a surface of the drift layer located in the second trench so that the first main electrode covers the principal surface of the source region and the principal surface of the base layer in common; and a second main electrode which is disposed on the other principal surface of the first conductivity type semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A wide band gap semiconductor device comprising:
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a silicon semiconductor substrate; a first conductivity type gallium nitride semiconductor layer having a high impurity concentration and disposed through a crystal structure conversion buffer layer on one principal surface of the silicon semiconductor substrate; a first conductivity type gallium nitride drift layer having a low impurity concentration and disposed on the first conductivity type gallium nitride semiconductor layer; a second conductivity type gallium nitride base layer disposed on the drift layer; a first conductivity type gallium nitride source region selectively disposed on a principal surface of the base layer; a first trench having a depth extending from a principal surface of the source region to reach the drift layer; a control electrode which is filled through a gate insulating film, in the first trench so as to be located in a position facing the source region, the base layer and the drift layer; a second trench provided near the first trench and having a depth extending from the principal surface of the base layer to reach the drift layer so as to be same depth as or deeper than the first trench; a first main electrode which is disposed in the second trench to form a Schottky junction between the first main electrode and a surface of the drift layer located in the second trench so that the first main electrode covers the principal surface of the source region and the principal surface of the base layer in common; third trenches each of which has a depth extending from the other principal surface of the silicon semiconductor substrate to pierce the silicon semiconductor substrate and the buffer layer and reach the first conductivity type gallium nitride semiconductor layer having the high impurity concentration; and a second main electrode which is electrically connected to inner surfaces of the third trenches and the other principal surface of the silicon semiconductor substrate. - View Dependent Claims (9, 10, 17)
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11. A wide band gap semiconductor device comprising:
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a silicon carbide semiconductor substrate; a second conductivity type silicon carbide semiconductor layer having a high impurity concentration and disposed on one principal surface of the semiconductor substrate; a second conductivity type silicon carbide drift layer having a low impurity concentration and disposed on the second conductivity type silicon carbide semiconductor layer; a first conductivity type silicon carbide base layer disposed on the drift layer; a second conductivity type silicon carbide source region selectively disposed on a principal surface of the base layer; a first trench having a depth extending from a principal surface of the source region to reach the drift layer; a control electrode which is filled through a gate insulating film, in the first trench so as to be located in positions facing the source region, the base layer and the drift layer; a second trench provided near the first trench and having a depth extending from the principal surface of the base layer to reach the drift layer so as to be deeper than the first trench; a first main electrode which is disposed in the second trench to form a Schottky junction between the first main electrode and a surface of the drift layer located in the second trench so that the first main electrode covers the principal surface of the source region and the principal surface of the base layer in common; and a second main electrode which is disposed on the other principal surface of the silicon carbide semiconductor substrate. - View Dependent Claims (12, 13)
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14. A wide band gap semiconductor device comprising:
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a silicon carbide semiconductor substrate; a second conductivity type silicon carbide semiconductor layer having a high impurity concentration and disposed on one principal surface of the semiconductor substrate; a second conductivity type silicon carbide drift layer having a low impurity concentration and disposed on the second conductivity type silicon carbide semiconductor layer; a first conductivity type silicon carbide base layer disposed on the drift layer; a second conductivity type silicon carbide source region selectively disposed on a principal surface of the base layer; a first trench having a depth extending from a principal surface of the source region to reach the drift layer; a control electrode which is filled through a gate insulating film, in the first trench so as to be located in a position facing the source region, the base layer and the drift layer; a second trench provided near the first trench and having a depth extending from the principal surface of the base layer to reach the drift layer so as to be deeper than the first trench; a first main electrode which is disposed in the second trench to form a Schottky junction between the first main electrode and a surface of the drift layer located in the second trench so that the first main electrode covers the principal surface of the source region and the principal surface of the base layer in common; third trenches each of which has a depth extending from the other principal surface of the silicon carbide semiconductor substrate to reach the second conductivity type silicon carbide semiconductor layer having the high impurity concentration; and a second main electrode which is electrically connected to inner surfaces of the third trenches and the other principal surface of the silicon carbide semiconductor substrate. - View Dependent Claims (15, 16, 18)
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Specification