SIDE VIEW LIGHT EMITTING DIODE PACKAGE

• US 20090283792A1
• Filed: 07/28/2009
• Published: 11/19/2009
• Est. Priority Date: 11/25/2005
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Roh, Jae Ky, Song, Young Jae, KIM, Chang Wook, Kim, Byung Man, Han, Yoon Suk, Hong, Seong Jae
• Application Number:
  US12/510,520
• Publication Number:
  US 20090283792A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

Claims

1-12. -12. (canceled)

13. A side view light emitting diode package comprising:

a package body having a cavity with an inner sidewall inclined between a bottom and a top;

first and second lead frames arranged in the package body, a portion of each of the first and second lead frames placed in the bottom of the cavity;

a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames; and

at least one wire for electrically connecting the light emitting diode chip to at least one of the first and second lead frames,

wherein the wire is arranged in such a fashion that a height from a top surface of the light emitting diode chip to a top end of the wire is 100 μ

m or less; and

,

wherein the mounting height of the light emitting diode chip is from 50 μ

m to 200 μ

m, and the depth of the cavity is from 200 μ

m to 480 μ

m.

14. The side view light emitting diode package according to claim 13,

wherein the wire having one end connected to a bump ball of the lead frame and the other end stitch-bonded to the light emitting diode chip

15. The side view light emitting diode package according to claim 13,

wherein a transparent encapsulant formed in the cavity surrounding the light emitting diode chip and comprising silicone resin.