Lithographic Apparatus and Device Manufacturing Method

• US 20090284720A1
• Filed: 07/21/2009
• Published: 11/19/2009
• Est. Priority Date: 05/30/2003
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Van Leeuwen, Robbert Edgar, George, Richard Alexander, Burghoorn, Jacobus, Gui, Cheng-Qun, De Jager, Pieter Willem Herman
• Granted Patent: US 8,395,755 B2
• Time in Patent Office: Days
• US Class Current: 355/52
• CPC Class Codes: G03B 27/53 Automatic registration or positioning of originals with respect to each other or the photosensitive layer
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70791 Large workpieces, e.g. glass substrates for flat panel displays or solar panels
• CPC Class Codes: G03F 9/7003 Alignment type or strategy, e.g. leveling, global alignment
• CPC Class Codes: G03F 9/7026 Focusing

Abstract

A lithography apparatus includes a projection system configured to project a radiation beam onto a substrate, a detector configured to inspect the substrate, and a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector. The detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam.

Claims

1. A lithography apparatus comprising:

a projection system configured to project a radiation beam onto a substrate;

a detector configured to inspect the substrate; and

a substrate table configured to support the substrate and move the substrate relative to the projection system and the detector;

wherein the detector is arranged to inspect a portion of the substrate while the substrate is moved and before the portion is exposed to the radiation beam.

2. The apparatus of claim 1, wherein the detector has a plurality of sensors configured to substantially simultaneously inspect a plurality of portions of the substrate across a full width of the substrate.

3. The apparatus of claim 1, further comprising a controller configured to adjust exposure conditions based on the inspecting.

4. The apparatus of claim 1, wherein the apparatus is configured to provide a patterned beam using an array of individually controllable elements.

5. The apparatus of claim 4, wherein the apparatus comprises a plurality of arrays of individually controllable elements.

6. A device manufacturing method comprising:

moving a substrate relative to a projection system and a detector;

inspecting a portion of the substrate using the detector; and

exposing the portion of the substrate using the projection system while the exposure conditions are adjusted according to the inspection.

7. The method of claim 6, wherein the inspecting and the exposing occurs while moving the substrate.

8. The method of claim 6, wherein moving the substrate relative to the projection system and the detector occurs between consecutive exposures.

9. The method of claim 6, wherein moving the substrate relative to the projection system and the detector occurs during continuous exposure.

10. The method of claim 6, wherein the portion of the substrate being inspected subsequently becomes the portion of the substrate being exposed.

11. The method of claim 6, wherein the exposure conditions are adjusted to optimize for overlay accuracy.

12. The method of claim 6, wherein the substrate moves at a substantially constant velocity relative to the projection system and the detector.

13. The method of claim 6, wherein the position of the detector relative to the projection system is substantially fixed and known.

14. The method of claim 6, further comprising monitoring the position of the detector relative to the projection system during exposure.

15. The method of claim 6, wherein the portion of the substrate comprises a full width of the substrate.