SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

• US 20090284942A1
• Filed: 04/23/2009
• Published: 11/19/2009
• Est. Priority Date: 05/19/2008
• Status: Active Grant

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: SAIKI, Atsushi, YUI, Takashi
• Granted Patent: US 8,022,305 B2
• Time in Patent Office: Days
• US Class Current: 361/783
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/0909 Preformed cutting or breaking line
• CPC Class Codes: H05K 2203/167 Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
• CPC Class Codes: H05K 3/005 Punching of holes
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A semiconductor device fabrication method includes: forming an elongated hole 5 in a wiring board plate along a perimeter line 3 of a plurality of wiring board regions defined over the wiring board plate with a connecting portion left unremoved at a corner of each of the wiring board regions; mounting semiconductor elements on the wiring board regions; and cutting the connecting portion using a punch 8 to isolate the wiring board regions from the wiring board plate into wiring boards. Each of the wiring boards has a cut edge formed by the punch, the cut edge starting from an end of the elongated hole 5 provided on a first side of the perimeter line 3 and extending across part of the connecting portion inside the perimeter line 3, the cut edge being angled inward of the wiring board so as to slope downward from the end of the elongated hole 5.

Claims

1. A method for fabricating a semiconductor device including a semiconductor element mounted on a wiring board, the method comprising:

forming an elongated hole in a wiring board plate along a perimeter line of a plurality of wiring board regions defined over the wiring board plate with a connecting portion left unremoved at a corner of each of the wiring board regions;

mounting semiconductor elements on the wiring board regions; and

cutting the connecting portion using a punch to isolate the wiring board regions from the wiring board plate into wiring boards, each of the wiring boards having a cut edge formed by the punch, the cut edge starting from an end of the elongated hole provided on a first side of the perimeter line and extending across part of the connecting portion inside the perimeter line, the cut edge being angled inward of the wiring board so as to slope downward from the end of the elongated hole.

2. The method of claim 1, further comprising forming a hole at the corner of the wiring board region before cutting the connecting portion,

wherein cutting the connecting portion using the punch results in that the wiring board has a cut edge extending across the connecting portion between the end of the elongated hole provided on the first side and the corner hole, the cut edge being angled inward of the wiring board so as to slope downward to the corner hole.

3. The method of claim 1, wherein

cutting the connecting portion using the punch results in that the wiring board has a cut edge extending across the connecting portion between the end of the elongated hole provided on the first side and an end of the elongated hole provided on a second side of the perimeter line which is adjacent to the first side, the cut edge being angled inward of the wiring board so as to slope downward to the end of the second elongated hole.

4. The method of claim 3, wherein forming the elongated hole includes forming the elongated hole along the second side of the perimeter line so as to reach outside the perimeter line.

5. The method of claim 1, wherein cutting the connecting portion using the punch includes setting an angle θ

of the punch relative to the elongated hole provided on the first side in the range of 0°

<

θ

≦

5°

.

6. The method of claim 1, wherein

the wiring board is formed by a base material molded with a resin, the base material being woven of warp and weft fibers, and

the cut edge angled inward of the wiring board extends in a direction not parallel to the fibers of the base material.

7. A semiconductor device, comprising:

a wiring board; and

a semiconductor element mounted on the wiring board,

wherein at least one side of the wiring board is formed by a first linear part extending toward a corner of the wiring board and a second linear part angled inward of the wiring board so as to slope downward from the first linear part to the corner of the wiring board.

8. The semiconductor device of claim 7, wherein

the corner of the wiring board has a curved part recessed inside the wiring board, and

at least one side of the wiring board is formed by the first linear part, the second linear part, and the curved part.

9. The semiconductor device of claim 7, wherein an angle θ

of the second linear part relative to the first linear part is in the range of 0°

<

θ

≦

5°

.

10. The semiconductor device of claim 7, wherein

the wiring board is formed by a base material molded with a resin, the base material being woven of warp and weft fibers, and

the second linear part extends in a direction not parallel to the fibers of the base material.