METHOD OF MANUFACTURING A COORDINATE DETECTOR
First Claim
1. A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film, the method comprising the steps of:
- (a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator;
(b) forming a resist pattern on the resistive film by exposing the applied photoresist to light through a predetermined mask and subsequently developing the applied photoresist;
(c) forming a resistive film removal region by removing a portion of the resistive film without the resist pattern;
(d) removing the resist pattern after said step (c); and
(e) forming the common electrode over the resistive film removal region after said step (d).
1 Assignment
0 Petitions
Accused Products
Abstract
A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film is disclosed that includes the steps of (a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator; (b) forming a resist pattern on the resistive film by exposing the applied photoresist to light through a predetermined mask and subsequently developing the applied photoresist; (c) forming a resistive film removal region by removing a portion of the resistive film without the resist pattern; (d) removing the resist pattern after step (c); and (e) forming the common electrode over the resistive film removal region after step (d).
-
Citations
10 Claims
-
1. A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film, the method comprising the steps of:
-
(a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator; (b) forming a resist pattern on the resistive film by exposing the applied photoresist to light through a predetermined mask and subsequently developing the applied photoresist; (c) forming a resistive film removal region by removing a portion of the resistive film without the resist pattern; (d) removing the resist pattern after said step (c); and (e) forming the common electrode over the resistive film removal region after said step (d). - View Dependent Claims (2, 3)
-
-
4. A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film, the method comprising the steps of:
-
(a) applying a photoresist onto the resistive film formed on a substrate formed of an insulator; (b) forming a resist pattern on the resistive film by exposing the applied photoresist to light through a predetermined mask and subsequently developing the applied photoresist; and (c) forming a resistive film removal region by removing a portion of the resistive film without the resist pattern, wherein the common electrode is formed between a peripheral edge of the resistive film and the resistive film removal region so that a distance between adjacent sides of the common electrode and the resistive film removal region is more than or equal to 0 mm and less than or equal to 5 mm. - View Dependent Claims (5, 6)
-
-
7. A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film, the method comprising the steps of:
-
(a) printing an etching paste on a portion of the resistive film formed on a substrate formed of an insulator, the portion being to be removed to form a resistive film removal region; (b) removing the portion of the resistive film with the etching paste by heat treatment; (c) removing the remaining etching paste after the heat treatment; and (d) forming the common electrode over the resistive film removal region. - View Dependent Claims (8)
-
-
9. A method of manufacturing a coordinate detector having a resistive film and a common electrode for applying a voltage to the resistive film, the method comprising the steps of:
-
(a) printing an etching paste on a portion of the resistive film formed on a substrate formed of an insulator, the portion being to be removed to form a resistive film removal region; (b) removing the portion of the resistive film with the etching paste by heat treatment; and (c) removing the remaining etching paste after the heat treatment, wherein the common electrode is formed between a peripheral edge of the resistive film and the resistive film removal region so that a distance between adjacent sides of the common electrode and the resistive film removal region is more than or equal to 0 mm and less than or equal to 5 mm. - View Dependent Claims (10)
-
Specification