Method of manufacturing light emitting diode package

• US 20090286337A1
• Filed: 01/10/2008
• Published: 11/19/2009
• Est. Priority Date: 03/13/2007
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Joung, Jae Woo, Choi, Joon Rak, Lee, Young Il
• Granted Patent: US 7,795,055 B2
• Time in Patent Office: Days
• US Class Current: 438/27
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

Abstract

There is provided a method of manufacturing a light emitting diode chip, the method including: providing a light emitting diode chip; forming a phosphor layer on a top of the light emitting diode chip; and forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder. There is also provided A method of manufacturing a light emitting diode package, the method including: forming a phosphor layer with a predetermined thickness; forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip.

Claims

1. A method of manufacturing a light emitting diode chip, the method comprising:

providing a light emitting diode chip;

forming a phosphor layer on a top of the light emitting diode chip; and

forming phosphors of a lattice structure on the phosphor layer by an inkjet process using an ink containing phosphor powder.

2. The method of claim 1, wherein the phosphor layer is attached on the top of the light emitting diode chip,

wherein the method further comprises:

mounting the light emitting diode chip having the phosphor layer attached on the top thereof in a housing; and

molding an inner portion of the package housing with a transparent resin.

3. The method of claim 1, wherein the providing a light emitting diode chip comprises:

mounting the light emitting diode chip in the package housing; and

molding an inner portion of the package housing with a transparent resin,

wherein the phosphor layer is formed on a top of the transparent resin.

4. The method of claim 1, wherein the phosphors of the lattice structure are arranged in a plurality of dots.

5. The method of claim 1, wherein the phosphors of the lattice structure have a refractivity greater than a refractivity of the phosphor layer.

6. A method of manufacturing a light emitting diode package, the method comprising:

forming a phosphor layer with a predetermined thickness;

forming phosphors of a lattice structure on the phosphor layer by an ink jet process using an ink containing phosphor powder; and

disposing the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the light emitting diode chip.

7. The method of claim 6, wherein the disposing the phosphor layer comprises:

attaching the phosphor layer having the phosphors of the lattice structure formed thereon on the top of the light emitting diode chip;

mounting the light emitting diode chip having the phosphor layer attached thereon in a package housing; and

molding an inner portion of the package housing with a transparent resin.

8. The method of claim 6, wherein the disposing the phosphor layer comprises:

mounting the light emitting diode chip in the package housing;

molding an inner portion of the package housing with a transparent resin; and

attaching the phosphor layer having the phosphors of the lattice structure formed thereon on a top of the transparent resin.

9. The method of claim 6, wherein the phosphors of the lattice structure are formed on a sheet of the phosphor layer,

wherein the method further comprises:

cutting the sheet of the phosphor layer having the phosphors of the lattice structure into unit chips before the disposing the phosphor layer having the phosphors of the lattice structure formed thereon.

10. The method of claim 6, wherein the phosphors of the lattice structure are arranged in a plurality of dots.

11. The method of claim 6, wherein the phosphors of the lattice structure have a refractivity greater than a refractivity of the phosphor layer.