×

METHOD FOR CRITICAL DIMENSION SHRINK USING CONFORMAL PECVD FILMS

  • US 20090286402A1
  • Filed: 10/23/2008
  • Published: 11/19/2009
  • Est. Priority Date: 05/13/2008
  • Status: Abandoned Application
First Claim
Patent Images

1. A method of reducing critical dimension of a recess having sidewalls and a bottom portion formed in a substrate having a field region, comprising:

  • applying a conformal layer over the field region, sidewalls, and bottom portion;

    removing the conformal layer from the bottom portion by a directional etch process to expose the substrate;

    etching the exposed substrate at the bottom portion; and

    removing the conformal layer by a wet etch process.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×