SHOWER PLATE, AND PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD USING THE SHOWER PLATE

• US 20090286405A1
• Filed: 06/13/2007
• Published: 11/19/2009
• Est. Priority Date: 06/13/2006
• Status: Abandoned Application

• Current Assignee: National University Corporation Chiba University, Tokyo Electron Limited
• Original Assignee: National University Corporation Chiba University, Tokyo Electron Limited
• Inventors: Ohmi, Tadahiro, Goto, Tetsuya, Ishibashi, Kiyotaka, Okesaku, Masahiro
• Application Number:
  US12/304,289
• Publication Number:
  US 20090286405A1
• Time in Patent Office: Days
• US Class Current: 438/710
• CPC Class Codes: C23C 16/455 characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: C23C 16/45572 Cooled nozzles
• CPC Class Codes: C23C 16/511 using microwave discharges
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow

Abstract

Provided is a shower plate in which there'"'"'s no need for a cover plate. The shower plate 105 is disposed in a processing chamber 102 of a plasma processing apparatus, for discharging a plasma excitation gas to generate plasma in the processing chamber 102, and the shower plate 105 includes a horizontal hole 111 for introducing the plasma excitation gas into the shower plate 105 from a gas inlet port 110 of the plasma processing apparatus; and a vertical hole 112 communicating with the horizontal hole 111, wherein the shower plate 105 is formed as a single body.

Claims

1. A shower plate disposed in a processing chamber of a plasma processing apparatus, for discharging a plasma excitation gas to generate plasma in the processing chamber, the shower plate comprising:

a horizontal hole for introducing the plasma excitation gas into the shower plate from a gas inlet port of the plasma processing apparatus; and

a vertical hole communicating with the horizontal hole, for discharging the plasma excitation gas,

wherein the shower plate is formed as a single body.

2. The shower plate of claim 1, wherein the horizontal hole is formed toward a central portion of the shower plate from a side surface thereof.

3. The shower plate of claim 2, wherein the horizontal hole is provided at plural locations along a circumferential direction of the shower plate.

4. A plasma processing apparatus provided in a processing chamber with a shower plate as claimed in any one of claims 1 to 3.

5. A plasma processing method comprising:

supplying a plasma excitation gas into a plasma processing apparatus by using a shower plate as claimed in any one of claims 1 to 3;

generating plasma by exciting the supplied plasma excitation gas by microwave; and

performing oxidation, nitridation, oxynitridation, CVD, etching or plasma irradiation on a substrate by using the plasma.

6. An electronic device manufacturing method comprising a process for processing a substrate by a plasma processing method as claimed in claim 5.