Enclosure for surveillance hardware

• US 20090288424A1
• Filed: 02/20/2009
• Published: 11/26/2009
• Est. Priority Date: 05/23/2008
• Status: Abandoned Application

• Current Assignee: Leverage Information Systems
• Original Assignee: Leverage Information Systems
• Inventors: Leblond, Raymond G.
• Application Number:
  US12/378,867
• Publication Number:
  US 20090288424A1
• Time in Patent Office: Days
• US Class Current: 62/3.300
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect

Abstract

The enclosure for surveillance hardware provided herein protects the hardware from external elements and from damage. The enclosure may be configured for a node of a peer to peer surveillance architecture. The enclosure may comprise a sealed component chamber and an adjacent support chamber. The sealed component chamber may enclose the components therein in an air or watertight manner. The support chamber may comprise an airflow system and thermal conductor which regulates the temperature in the component chamber. The enclosure may be formed from a multilayer material having various protective qualities. A controller may be provided to control operation of the airflow system and thermal conductor in response to changes in temperature.

Claims

1. An enclosure for a node comprising:

a rigid multilayer material;

a sealed component chamber formed from the multilayer material, the sealed component chamber configured to enclose one or more components of the node; and

a support chamber adjacent the sealed component chamber, the support chamber comprising;

one or more vents configured to allow the passage of air;

a thermal conductor configured to lower the temperature of the sealed component chamber;

an airflow system configured to generate at least one airflow from the air; and

a power supply.

2. The enclosure of claim 1, wherein the sealed component chamber further comprises a dome configured to allow a camera to capture images.

3. The enclosure of claim 1, wherein the support chamber further comprises one or more baffles to direct the at least one airflow.

4. The enclosure of claim 1, wherein the airflow system comprises a fan assembly having at least two fans aligned in series by at least one spacer.

5. The enclosure of claim 1, wherein the thermal conductor is a Peltier device comprising a cooled portion and a heated portion whereby the cooled portion is in physical contact with the sealed component chamber and the heated portion is cooled by the airflow system.

6. The enclosure of claim 5, wherein at least a portion of the cooled portion is within the sealed component chamber.

7. The enclosure of claim 1, wherein the multilayer material comprises an aluminum layer, an insulating layer, and a coating layer.

8. The enclosure of claim 1 further comprising:

one or more heating elements; and

a controller configured to activate the one or more heating elements to prevent damage caused by cold temperatures.

9. An enclosure for a node comprising:

a sealed component chamber configured to enclose one or more components of the node; and

a support chamber adjacent the sealed component chamber, the support chamber comprising;

an air inflow vent at a first end of the support chamber;

an air outflow vent at a second end of the support chamber;

an airflow system adjacent the air inflow vent, the airflow system configured to generate at least one airflow; and

a thermal conductor comprising a Peltier device adjacent the airflow system, a portion of the thermal conductor in contact with the sealed component chamber.

10. The enclosure of claim 9, wherein the airflow system is supported within the support chamber by one or more mounts, whereby the one or more mounts form an airtight seal around the airflow system within the support chamber.

11. The enclosure of claim 9, wherein the airflow system comprises at least two fans aligned in series by at least one spacer.

12. The enclosure of claim 9, wherein the support chamber further comprises a power supply adjacent the thermal conductor.

13. The enclosure of claim 9, wherein the support chamber further comprises a baffle adjacent the air outflow vent.

14. The enclosure of claim 9, wherein the support chamber further comprises a controller configured to turn on the Peltier device at a first temperature threshold and turn off the Peltier device at a second temperature threshold whereby the first temperature threshold is at a higher temperature than the second temperature threshold.

15. A method of protecting components of a node within an enclosure comprising:

providing a sealed component chamber comprising a multilayer material to enclose one or more components of a node;

providing power to the one or more components with a power supply;

transferring heat from the sealed component chamber to an adjacent support chamber through a thermal conductor;

generating at least one airflow with a airflow system within the support chamber to cool the thermal conductor, wherein the at least one airflow is generated with a fan assembly within the support chamber, the fan assembly comprising at least two fans aligned in series by at least one spacer;

measuring at least one temperature of the sealed component chamber with a temperature sensor;

activating the thermal conductor to cool the sealed component chamber if the at least one temperature is above a first temperature threshold; and

deactivating the thermal conductor if the at least one temperature is below a second temperature threshold.

16. The method of claim 15 further comprising disabling power to the one or more components if the at least one temperature increases beyond a heat threshold for the one or more components.

17. The method of claim 15 further comprising activating one or more heating elements if the at least one temperature is below a cold threshold for the one or more components.

18. The method of claim 15, wherein the sealed component chamber comprises a multilayer material comprising a rigid structural layer, an insulating layer, and a coating layer.

19. The method of claim 15, wherein the thermal conductor comprises a Peltier device.

20. The method of claim 15 further comprising reporting one or more error conditions of the airflow system via a transceiver.