Enclosure for surveillance hardware
First Claim
1. An enclosure for a node comprising:
- a rigid multilayer material;
a sealed component chamber formed from the multilayer material, the sealed component chamber configured to enclose one or more components of the node; and
a support chamber adjacent the sealed component chamber, the support chamber comprising;
one or more vents configured to allow the passage of air;
a thermal conductor configured to lower the temperature of the sealed component chamber;
an airflow system configured to generate at least one airflow from the air; and
a power supply.
1 Assignment
0 Petitions
Accused Products
Abstract
The enclosure for surveillance hardware provided herein protects the hardware from external elements and from damage. The enclosure may be configured for a node of a peer to peer surveillance architecture. The enclosure may comprise a sealed component chamber and an adjacent support chamber. The sealed component chamber may enclose the components therein in an air or watertight manner. The support chamber may comprise an airflow system and thermal conductor which regulates the temperature in the component chamber. The enclosure may be formed from a multilayer material having various protective qualities. A controller may be provided to control operation of the airflow system and thermal conductor in response to changes in temperature.
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Citations
20 Claims
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1. An enclosure for a node comprising:
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a rigid multilayer material; a sealed component chamber formed from the multilayer material, the sealed component chamber configured to enclose one or more components of the node; and a support chamber adjacent the sealed component chamber, the support chamber comprising; one or more vents configured to allow the passage of air; a thermal conductor configured to lower the temperature of the sealed component chamber; an airflow system configured to generate at least one airflow from the air; and a power supply. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An enclosure for a node comprising:
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a sealed component chamber configured to enclose one or more components of the node; and a support chamber adjacent the sealed component chamber, the support chamber comprising; an air inflow vent at a first end of the support chamber; an air outflow vent at a second end of the support chamber; an airflow system adjacent the air inflow vent, the airflow system configured to generate at least one airflow; and a thermal conductor comprising a Peltier device adjacent the airflow system, a portion of the thermal conductor in contact with the sealed component chamber. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method of protecting components of a node within an enclosure comprising:
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providing a sealed component chamber comprising a multilayer material to enclose one or more components of a node; providing power to the one or more components with a power supply; transferring heat from the sealed component chamber to an adjacent support chamber through a thermal conductor; generating at least one airflow with a airflow system within the support chamber to cool the thermal conductor, wherein the at least one airflow is generated with a fan assembly within the support chamber, the fan assembly comprising at least two fans aligned in series by at least one spacer; measuring at least one temperature of the sealed component chamber with a temperature sensor; activating the thermal conductor to cool the sealed component chamber if the at least one temperature is above a first temperature threshold; and deactivating the thermal conductor if the at least one temperature is below a second temperature threshold. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification