Electronic device and method of manufacturing the same

• US 20090288852A1
• Filed: 04/27/2009
• Published: 11/26/2009
• Est. Priority Date: 05/20/2008
• Status: Abandoned Application

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Inventors: Hirokawa, Tomoaki, Kakuta, Yuji, Sakura, Naoki, Matsunoshita, Makoto
• Application Number:
  US12/385,994
• Publication Number:
  US 20090288852A1
• Time in Patent Office: Days
• US Class Current: 174/50.520
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48095 Kinked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/06 characterised by the material of the container or its electrical properties
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01055 : Cesium [Cs]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16315 : Shape
• CPC Class Codes: H01L 2924/166 : Material
• CPC Class Codes: Y10T 156/1052 : with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 156/1089 : of discrete laminae to single face of additional lamina

Abstract

An electronic device of the present invention has a substrate; an electro-conductive pattern (electrodes) provided over the substrate; a semiconductor chip mounted over the substrate, and electrically connected with the electrodes; a resin cap provided over the substrate and composed of two or more resin layers to hollow-sealing the semiconductor chip; and an adhesive layer (metal-resin adhesion maintenance layer) bonding the resin cap with the electrode.

Claims

1. An electronic device comprising:

a substrate;

an electro-conductive pattern provided over said substrate;

an electronic component mounted over said substrate, and electrically connected to said electro-conductive pattern;

a resin cap provided over said substrate, and composed of two or more resin layers hollow-sealing said electronic component; and

an adhesive layer bonding said resin cap with said electro-conductive pattern.

2. The electronic device as claimed in claim 1,

wherein said adhesive layer is an inorganic layer containing aluminum oxide, or an organic layer containing alkyd resin.

3. The electronic device as claimed in claim 1,

wherein said substrate has a through-hole extended therethrough in the thickness-wise direction,

said electro-conductive pattern is extended from the top surface of said substrate through said through-hole out onto the back surface, and

said resin cap comprises:

a first resin layer bonded to said electro-conductive pattern while placing said adhesive layer in between so as to hollow-seal said electronic component;

a second resin layer covering said first resin layer; and

a third resin layer covering said second resin layer.

4. The electronic device as claimed in claim 3,

wherein said second resin layer covers an opening of said through-hole on the top surface side of said substrate.

5. The electronic device as claimed in claim 3,

wherein said second resin layer is composed of a resin film.

6. The electronic device as claimed in claim 1,

wherein said electronic component operates at high frequencies.

7. The electronic device as claimed in claim 1, obtained by singulation between every adjacent electronic components mounted on said substrate.

8. A method of manufacturing an electronic device comprising:

preparing a substrate having an electro-conductive pattern formed thereon;

forming an adhesive layer over said electro-conductive pattern provided over said substrate;

mounting an electronic component over said substrate, and electrically connecting said electronic component with said electro-conductive pattern; and

bonding a resin cap composed of two or more resin layers with said electro-conductive pattern while placing said adhesive layer in between, so as to hollow-seal said electronic component.

9. The method of manufacturing an electronic device as claimed in claim 8

wherein said forming said adhesive layer further comprises:

forming an adhesive layer composed of either an inorganic layer containing aluminum oxide, or an organic layer containing alkyd resin.

10. The method of manufacturing an electronic device as claimed in claim 8,

wherein said preparing said substrate further comprises:

preparing a substrate having a plurality of through-holes extended therethrough in the thickness-wise direction, and having an electro-conductive pattern extended from the top surface thereof through said through-holes out onto the back surface thereof,

wherein said electrically connecting said electronic component with said electro-conductive pattern further comprises;

mounting a plurality of said electronic components onto regions of said substrate having no through-holes formed therein, and

said hollow-sealing said electronic component further comprises;

forming a first resin layer which bonds to said electro-conductive pattern while placing said adhesive layer in between, so as to hollow-seal said electronic component;

forming a second resin layer over said first resin layer; and

forming a third resin layer over said second resin layer.

11. The method of manufacturing an electronic device as claimed in claim 10,

wherein said forming said second resin layer further comprises:

forming said second resin layer which covers said first resin layer, and covers also the opening of said through-hole over the top surface side of said substrate.

12. The method of manufacturing an electronic device as claimed in claim 11,

wherein said forming said second resin layer further comprises:

covering the entire top surface of said substrate with said second resin layer composed of a resin film, and bonding said second resin layer with said substrate while pressurizing it towards the top surface of said substrate.

13. The method of manufacturing an electronic device as claimed in claim 8, further comprising, after said hollow-sealing said electronic components,

singulating the electronic device by dicing said substrate between every adjacent electronic components.