SEMICONDUCTOR DEVICE

• US 20090289341A1
• Filed: 05/19/2009
• Published: 11/26/2009
• Est. Priority Date: 05/23/2008
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Nakada, Masataka, Oikawa, Yoshiaki, Shoji, Hironobu, Shionoiri, Yutaka, Kato, Kiyoshi, Yamazaki, Shunpei
• Granted Patent: US 8,237,248 B2
• Time in Patent Office: Days
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/1266 the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

An object is to provide a highly reliable semiconductor device having resistance to external stress and electrostatic discharge while achieving reduction in thickness and size. Another object is to prevent defective shapes and deterioration in characteristics due to external stress or electrostatic discharge in a manufacture process to manufacture a semiconductor device with a high yield. A first insulator and a second insulator facing each other, a semiconductor integrated circuit and an antenna provided between the first insulator and the second insulator facing each other, a conductive shield provided on one surface of the first insulator, and a conductive shield provided on one surface of the second insulator are provided. The conductive shield provided on one surface of the first insulator and the conductive shield provided on one surface of the second insulator are electrically connected.

Claims

1. A semiconductor device comprising:

a first insulator having a first surface and a second surface opposite to the first surface;

a second insulator having a third surface and a fourth surface opposite to the third surface so that the first surface and the third surface face each other;

a semiconductor integrated circuit;

an antenna,

wherein the semiconductor integrated circuit and the antenna are provided between the first insulator and the second insulator;

a first conductive layer provided on the second surface of the first insulator; and

a second conductive layer provided on the fourth surface of the second insulator,

wherein the first conductive layer and the second conductive layer are electrically connected.

2. The semiconductor device according to claim 1, wherein any one of the first conductive layer and the second conductive layer has a layered structure.

3. The semiconductor device according to claim 1, wherein the first conductive layer and the second conductive layer each have a metal film.

4. The semiconductor device according to claim 1, wherein the first conductive layer and the second conductive layer each comprises a metal oxide film, a metal nitride film, or a semiconductor film.

5. The semiconductor device according to claim 1, wherein at least one of the first insulator and the second insulator has a thickness of from 5 μ

m to 50 μ

m.

6. The semiconductor device according to claim 1, wherein at least one of the first insulator and the second insulator has a structure body in which a fibrous body is impregnated with an organic resin.

7. The semiconductor device according to claim 1, wherein electrical connection between the first conductive layer and the second conductive layer is performed with a conductor penetrating through the first insulator and the second insulator.

8. The semiconductor device according to claim 1, wherein the first conductive layer and the second conductive layer are conductive shields.

9. A semiconductor device comprising:

a first insulator;

a second insulator;

a semiconductor integrated circuit;

an antenna,

wherein the semiconductor integrated circuit and the antenna are provided between the first insulator and the second insulator facing each other;

a first conductive layer provided on one surface of the first insulator; and

a second conductive layer provided on one surface of the second insulator,

wherein the first conductive layer and the second conductive layer are electrically connected.

10. The semiconductor device according to claim 9, wherein any one of the first conductive layer and the second conductive layer has a layered structure.

11. The semiconductor device according to claim 9, wherein the first conductive layer and the second conductive layer each have a metal film.

12. The semiconductor device according to claim 9, wherein the first conductive layer and the second conductive layer each comprises a metal oxide film, a metal nitride film, or a semiconductor film.

13. The semiconductor device according to claim 9, wherein at least one of the first insulator and the second insulator has a thickness of from 5 μ

m to 50 μ

m.

14. The semiconductor device according to claim 9, wherein at least one of the first insulator and the second insulator has a structure body in which a fibrous body is impregnated with an organic resin.

15. The semiconductor device according to claim 9, wherein electrical connection between the first conductive layer and the second conductive layer is performed with a conductor penetrating through the first insulator and the second insulator.

16. The semiconductor device according to claim 9, wherein the first conductive layer and the second conductive layer are conductive shields.

17. The semiconductor device according to claim 9,

wherein a part of a side surface of the first insulator is exposed, and

wherein a part of a side surface of the second insulator is exposed.

18. A semiconductor device comprising:

a first insulator;

a second insulator;

a semiconductor integrated circuit;

a first antenna electrically connected to the semiconductor integrated circuit,

wherein the semiconductor integrated circuit and the first antenna are provided between the first insulator and the second insulator;

a first conductive layer provided on one surface of the first insulator;

a second conductive layer provided on one surface of the second insulator; and

a second booster antenna electromagnetically coupled with the first antenna,

wherein the first conductive layer and the second conductive layer are electrically connected.

19. The semiconductor device according to claim 18, wherein any one of the first conductive layer and the second conductive layer has a layered structure.

20. The semiconductor device according to claim 18, wherein the first conductive layer and the second conductive layer each have a metal film.

21. The semiconductor device according to claim 18, wherein the first conductive layer and the second conductive layer each comprises a metal oxide film, a metal nitride film, or a semiconductor film.

22. The semiconductor device according to claim 18, wherein at least one of the first insulator and the second insulator has a thickness of from 5 μ

m to 50 μ

m.

23. The semiconductor device according to claim 18, wherein at least one of the first insulator and the second insulator has a structure body in which a fibrous body is impregnated with an organic resin.

24. The semiconductor device according to claim 18, wherein electrical connection between the first conductive layer and the second conductive layer is performed with a conductor penetrating through the first insulator and the second insulator.

25. The semiconductor device according to claim 18, wherein the first conductive layer and the second conductive layer are conductive shields.

26. The semiconductor device according to claim 18, wherein the semiconductor integrated circuit communicates with the outside through the second booster antenna.

27. The semiconductor device according to claim 18,

wherein the second booster antenna is provided over a substrate, and

wherein a lamination of the first insulator, the second insulator, the semiconductor integrated circuit and the first antenna is provided over the second booster antenna.