Mica capacitor and fabrication method of the same

• US 20090290286A1
• Filed: 12/24/2008
• Published: 11/26/2009
• Est. Priority Date: 05/21/2008
• Status: Abandoned Application

• Current Assignee: Hoseo University Academic Cooperation Foundation, Sir Corporation
• Original Assignee: Hoseo University Academic Cooperation Foundation, Sir Corporation
• Inventors: Park, Nho Kyung, Yun, Eui Jung, Choi, Cheal Soon
• Application Number:
  US12/317,614
• Publication Number:
  US 20090290286A1
• Time in Patent Office: Days
• US Class Current: 361/325
• CPC Class Codes: H01G 4/08 Inorganic dielectrics
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

The mica capacitor and fabrication method there for, resulting in parallely stacking basic laminates in which an electrode sheet is arranged between parallely stacked mica sheets to protrude in a zigzag manner, arranging an insulation plate in which the basic laminates are parallely stacked where the insulation plate protruding in a zigzag manner is formed between the basic laminates, and filling a conductor between insulation protrusions, whereby a parallel connection is implemented on the basic laminates themselves while a serial connection is implemented between the basic laminates, thereby enabling a provision of mica capacitor having a high voltage property.

Claims

1. A mica capacitor, comprising:

a plurality of parallely and alternately stacked basic laminate layers and insulation plates, each basic laminate layer being formed of parallely stacked mica sheets and electrode sheets, the electrode sheets being alternatively arranged between the mica sheets and protruding lengthwise there from, first at one end and then at the other, to define zigzag electrode protrusions.

2. The mica capacitor according to claim 1, wherein said an insulation plates are alternatively arranged between the parallely-stacked basic laminates and protruding lengthwise there from, first at one end and then at the other, to define zigzag insulation protrusions.

3. The mica capacitor according to claim 2, further comprising a conductor filled in between same-ended pairs of insulation protrusions to allow only electrode protrusions in the basic laminate to be short-circuited.

4. The mica capacitor of claim 1, wherein a non-protruding end of said electrode sheets form gaps between opposing mica sheets.

5. The mica capacitor of claim 1, further comprising conductor filled in the uppermost basic laminate and the lowermost basic laminate of the stacked basic laminate toward the insulation protrusions.

7. The mica capacitor of claim 3, further comprising insulation plates attached to an upper surface of an uppermost basic laminate and a lower surface of a lowermost basic laminate.

8. The mica capacitor of claim 1, wherein the conductor is a lead.

9. The mica capacitor of claim 1, wherein the electrode sheet is one of an an Ag paste or an electrode paper.

10. The mica capacitor of claim 1, wherein the mica sheet is in the thickness range of 0.01 mm˜

0.1 mm.

11. The mica capacitor of claim 1, wherein the mica capacitor further includes a molding insulation that molds the basic laminate, the insulation plate and the conductor.

12. The mica capacitor of claim 1, wherein the molding insulation is made of epoxy material.

16. The method of claim 12, wherein the conductor is a lead.

6. The mica capacitor of claim 6, wherein the conductor is filled only in the uppermost basic laminate, and the lowermost basic laminate is connected to outside.

13. A method for fabricating a mica capacitor, comprising the steps of:

forming a basic laminate in which an electrode sheet is arranged between parallely stacked mica sheets to protrude in a zigzag manner;

arranging an insulation plate in which the basic laminates are parallely stacked, and an insulation plate protruding in a zigzag manner is formed between the basic laminates; and

filling a conductor between insulation protrusions each protruded toward the insulation plate.

14. The method of claim 13, further comprising a step of connecting terminals to a conductor filled only in an uppermost basic laminate and a lowermost basic laminate.

15. The method of claim 14, further comprising a step of molding the basic laminate, the insulation plate and the conductor in their entirety using molding insulation.