WAVEGUIDE-BASED PACKAGING STRUCTURES AND METHODS FOR DISCRETE LIGHTING ELEMENTS

• US 20090290380A1
• Filed: 11/26/2008
• Published: 11/26/2009
• Est. Priority Date: 12/19/2007
• Status: Active Grant

• Current Assignee: Oree Advanced Illumination Solutions Ltd.
• Original Assignee: Oree, Advanced Illumination Solutions Inc.
• Inventors: Zimmermann, Micha, Meir, Noam, Fine, Eran
• Granted Patent: US 8,550,684 B2
• Time in Patent Office: Days
• US Class Current: 362/623
• CPC Class Codes: G02B 6/0065 Manufacturing aspects; Material aspects
• CPC Class Codes: G02B 6/0068 Arrangements of plural sources, e.g. multi-colour light sources
• CPC Class Codes: G02B 6/0073 Light emitting diode [LED]
• CPC Class Codes: G02B 6/008 of the partially overlapping type
• CPC Class Codes: G02B 6/0088 of the light guide or other optical sheets in the package

Abstract

In one aspect, an illumination source includes a socket formed by the union of a sub-assembly platform and a light-guide element, and a discrete light source received in the socket. In another aspect, the light-guide element includes a concentration region proximate an in-coupling region opposite an out-coupling region, the concentration region directing multidirectional light from the in-coupling region toward the out-coupling region.

Claims

1. An illumination source comprising a socket formed by the union of a sub-assembly platform and a light-guide element, and a discrete light source received in the socket.

2. The illumination source of claim 1, wherein the discrete light source comprises an LED die disposed over and electrically connected to the sub-assembly platform.

3. The illumination source of claim 2, wherein the light-guide element is disposed over and in direct contact with the sub-assembly platform and functions as at least a portion of a package for the LED die.

4. The illumination source of claim 3, further comprising an encapsulation material disposed between and in direct contact with the LED die and the light-guide element.

5. The illumination source of claim 1, wherein the sub-assembly platform comprises a contour electrical connection.

6. The illumination source of claim 1, wherein the discrete light source is thermally connected to the sub-assembly platform.

7. The illumination source of claim 1, wherein the sub-assembly platform comprises a mechanical interface for connecting the illumination source to a structure.

8. The illumination source of claim 1, wherein the light-guide element comprises spatially distinct in-coupling and out-coupling regions, light injected into the in-coupling region by the discrete light source being substantially retained within the light-guide element for emission from the out-coupling region.

9. The illumination source of claim 1, wherein the discrete light source is top-emitting.

10. The illumination source of claim 1, wherein the discrete light source is a Lambertian source.

11. A method of forming an illumination device, the method comprising:

providing a discrete light source in a recess in a sub-assembly platform; and

joining the sub-assembly platform to a light-guide element, thereby forming an enclosed socket in which the discrete light source is disposed.

12. The method of claim 11, further comprising providing an encapsulation material over the discrete light source such that the encapsulation material occupies any free volume in the enclosed socket.

13. The method of claim 11, further comprising, prior to providing the discrete light source, assembling the sub-assembly platform.

14. The method of claim 13, wherein joining the sub-assembly platform to a light-guide element is at least partially performed at a temperature lower than approximately 85°

C.

15. The method of claim 11, wherein the discrete light source is at least partially operated at a temperature lower than approximately 85°

C.

16. The method of claim 11, wherein the discrete light source is a bare-die LED.

17. The method of claim 11, further comprising:

providing electrical current through the sub-assembly platform to the discrete light source, the discrete light source thereby emitting light into the light-guide element.

18. The method of claim 11, wherein heat generated by the discrete light source is dissipated through the sub-assembly platform.

19. The method of claim 11, wherein the light is emitted substantially uniformly across a top surface of the light-guide element.

20. A light-guide element comprising:

an in-coupling region for receiving multidirectional light from a light source;

an out-coupling region for emitting light from the light-guide element; and

a concentration region proximate the in-coupling region opposite the out-coupling region, the concentration region directing multidirectional light from the in-coupling region toward the out-coupling region.

21. The light-guide element of claim 20, wherein the concentration region has a parabolic shape.

22. The light-guide element of claim 21, wherein a center of the parabolic shape is a center of the in-coupling region.

23. The light-guide element of claim 20, wherein the concentration region is offset from the in-coupling region.

24. The light-guide element of claim 20, wherein an angle of the light striking the concentration region is greater than an angle of total internal reflection.

25. The light-guide element of claim 20, wherein the sidewall comprises a reflective coating.

26. The light-guide element of claim 20, wherein the light transmitted to the concentration region is substantially reflected toward the out-coupling region.

27. The light-guide element of claim 20, wherein the light transmitted to the concentration region is substantially reflected toward the out-coupling region.

28. The light-guide element of claim 20, wherein the light transmitted to the concentration region is completely reflected toward the out-coupling region.

29. The light-guide element of claim 20, wherein the light reflected from the concentration region combines with light transmitted directly to the out-coupling region from the in-coupling region to create a uniform distribution of light intensity in the out-coupling region.

30. A light-guide element comprising an in-coupling region, a propagation region, an out-coupling region, a top surface, and a sidewall, wherein (i) light is received by the light-guide element at the in-coupling region, transmitted through the propagation region, and emitted by the out-coupling region, and (ii) the top surface and the sidewall are joined by a rounded corner, (iii) the top surface and the sidewall reflect light incident thereon, and (iv) the rounded corner transmits light incident thereon.

31. The light-guide element of claim 30, wherein the rounded corner is in the out-coupling region.

32. The light-guide element of claim 30, wherein the sidewall is polished.

33. A light-guide element comprising an in-coupling region, a propagation region, an out-coupling region, a top surface, and a sidewall, wherein (i) light is received by the light-guide element at the in-coupling region, transmitted through the propagation region, and emitted by the out-coupling region, (ii) the top surface and the sidewall are joined by a 90-degree corner, and (iii) the top surface, sidewall, and 90-degree corner reflect light incident thereon.

34. The light-guide element of claim 33, wherein the 90-degree corner is in the out-coupling region.

35. The light-guide element of claim 33, wherein the sidewall is polished.