HIGH RESOLUTION IMAGING SYSTEM

• US 20090290680A1
• Filed: 03/28/2005
• Published: 11/26/2009
• Est. Priority Date: 03/26/2004
• Status: Active Grant

• Current Assignee: Nova R&D Incorporated (Kromek Group PLC)
• Original Assignee: Nova R&D Incorporated (Kromek Group PLC)
• Inventors: Clajus, Martin, Tumer, Tumay O.
• Granted Patent: US 7,634,061 B1
• Time in Patent Office: Days
• US Class Current: 378/62
• CPC Class Codes: G01T 1/247 Detector read-out circuitry for processing gain or off-set correction H04N
• CPC Class Codes: G01T 1/249 specially adapted for use in SPECT or PET SPECT imaging G01T1/1642; PET imaging G01T1/2985; detecting prohibited goods, e.g. weapons, explosives, hazardous substances, contraband or smuggled objects G01V5/20
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/4847 the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
• CPC Class Codes: H04N 25/773 comprising photon counting circuits, e.g. single photon detection [SPD] or single photon avalanche diodes [SPAD]
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

New sensors, pixel detectors and different embodiments of multi-channel integrated circuit are disclosed. The new high energy and spatial resolution sensors use solid state detectors. Each channel or pixel of the readout chip employs low noise preamplifier at its input followed by other circuitry. The different embodiments of the sensors, detectors and the integrated circuit are designed to produce high energy and/or spatial resolution two-dimensional and three-dimensional imaging for different applications. Some of these applications may require fast data acquisition, some others may need ultra high energy resolution, and a separate portion may require very high contrast. The embodiments described herein addresses these issues and also other issues that may be useful in two and three dimensional medical and industrial imaging. The applications of the new sensors, detectors and integrated circuits addresses a broad range of applications such as medical and industrial imaging, NDE and NDI, security, baggage scanning, astrophysics, nuclear physics and medicine.

Claims

1-45. -45. (canceled)

46. A method for producing a plurality of images, comprising the steps of:

using at least one source of radiation;

constructing at least one position sensitive direct conversion detector;

producing at least one charge signal from at least one portion of radiation emitted from said at least one source of radiation in said at least one position sensitive direct conversion detector;

coupling at least one integrated circuit to said at least one position sensitive direct conversion detector, wherein said at least one integrated circuit produces at least one signal from said at least one charge signal;

directing said at least one source of radiation to said at least one position sensitive direct conversion detector;

placing at least one object between said at least one source of radiation and said at least one position sensitive direct conversion detector;

scanning at least one portion of said at least one object by said at least one position sensitive direct conversion detector; and

producing a plurality of images simultaneously for each scan of said at least one portion of said at least one object, wherein each of the plurality of images corresponds to a different depth within said at least one portion of said at least one object,

wherein at least two of said plurality of images are produced for different energy ranges.

47. The method for producing the plurality of images of claim 46, wherein said at least one position sensitive direct conversion detector has a plurality of pixels.

48. The method for producing the plurality of images of claim 46, wherein said at least one portion of radiation emitted from said at least one source of radiation is selected from the group consisting of positrons, electrons and photons.

49. The method for producing the plurality of images of claim 47, wherein said at least one signal is transferred from pixel to pixel within said plurality of pixels timed to a scan speed of said at least one position sensitive direct conversion detector.

50. The method for producing the plurality of images of claim 46, wherein said at least one position sensitive direct conversion detector is made to form an abuttable design wherein the abuttable design is selected from the group consisting of two-side abuttable, three-side abuttable and four-side abuttable design.

51. The method for producing the plurality of images of claim 49, wherein said at least one charge signal is accumulated across at least one column of pixels in the opposite direction of said scan motion and output at least at one position of said at least one column of pixels.

52. The method for producing the plurality of images of claim 46, wherein said at least one charge signal is accumulated over a plurality sections of said at least one position sensitive direct conversion detector using said at least one integrated circuit and output at multiple points across said at least one position sensitive direct conversion detector using said at least one integrated circuit.

53. The method for producing the plurality of images of claim 46, wherein said at least one integrated circuit is disposed under said at least one position sensitive direct conversion detector.

55. The method for producing the plurality of images of claim 46, wherein said at least one signal is at least one count signal used to produce said at least one image.

56. The method for producing the plurality of images of claim 55, wherein said at least one count signal is used to produce at least two images for different energy ranges.

57. The method for producing the plurality of images of claim 46, wherein TDI technique is used.

90. The method of claim 46, further comprising sequentially reading out alternating pixels of the detector, wherein scanning said at least one object is performed linearly.

91. The method of claim 46, further comprising:

rotating said at least one position sensitive direct conversion detector; and

rotating said at least one source of radiation.

104. The method for producing the plurality of images of claim 53, wherein at least one mounting board is disposed in between said at least one integrated circuit and said at least one position sensitive direct conversion detector.

54. (canceled)

58-65. -65. (canceled)

66. A method for producing at least two images, comprising the steps of:

using at least one source of radiation;

constructing at least one four-side abuttable position sensitive direct conversion detector;

producing at least one charge signal from at least one portion of radiation emitted from said at least one source of radiation in said at least one position sensitive direct conversion detector;

coupling at least one integrated circuit disposed under said at least one position sensitive direct conversion detector, wherein said at least one integrated circuit produces at least one signal from said at least one charge signal and wherein said at least one integrated circuit is a mixed signal integrated circuit having at least one analog circuit and at least one digital circuit;

directing said at least one source of radiation to said at least one position sensitive direct conversion detector;

placing at least one object between said at least one source of radiation and said at least one position sensitive direct conversion detector;

processing said at least one signal; and

producing at least two images of at least one portion of said at least one object.

wherein at least two of said at least two of images are produced for different energy ranges.

67. The method for producing the at least one image of claim 66, wherein said at least one position sensitive direct conversion detector has a plurality of pixels.

68. The method for producing the at least one image of claim 66, wherein said at least one portion of radiation emitted from said at least one source of radiation is selected from the group consisting of positrons, electrons and photons.

69. The method for producing the at least one image of claim 67, wherein said at least one signal is transferred from pixel to pixel within said plurality of pixels.

70. The method for producing the at least one image of claim 66, wherein said at least one four-side abuttable position sensitive direct conversion detector comprises at least two four-side abuttable position sensitive direct conversation detectors positioned to abut one another.

71. The method for producing the at least one image of claim 69, wherein said at least one charge signal is accumulated across at least one column of.

72. The method for producing the at least one image of claim 66, wherein said at least one charge signal is accumulated over a plurality sections of said at least one position sensitive direct conversion detector using said at least one integrated circuit and output at multiple points across said at least one position sensitive direct conversion detector using said at least one integrated circuit.

73. The method for producing the at least one image of claim 66, wherein said at least one image consists of a plurality of images, wherein each image corresponds to a different depth within said at least one object.

75. The method for producing the at least one image of claim 66, wherein said at least one signal is at least one count signal used to produce said at least one image.

76. The method for producing the at least one image of claim 75, wherein said at least one count signal used to produce at least two images for different energy ranges.

77. The method for producing the at least one image of claim 66, wherein TDI technique is used.

105. The method for producing the at least one image of claim 66, wherein at least one mounting board is disposed in between said at least one integrated circuit and said at least one position sensitive direct conversion detector.

74. (canceled)

78. An imaging system comprising in combination:

at least one source of radiation;

at least one position sensitive direct conversion detector, wherein said at least one position sensitive direct conversion detector produces at least one charge signal from at least one portion of radiation emitted from said at least one source of radiation and wherein said at least one source of radiation is directed to said at least one position sensitive direct conversion detector;

at least one integrated circuit coupled to said at least one position sensitive direct conversion detector, wherein said at least one integrated circuit produces at least one signal from said at least one charge signal;

at least one object placed between said at least one source of radiation and said at least one position sensitive direct conversion detector, wherein said at least one position sensitive direct conversion detector scans said at least one object;

at least one processing system responsive to said at least one signal; and

said at least one processing system processes said at least one signal to produce simultaneously at least two images for each scan of at least one portion of said at least one object, wherein each of said at least two images correspond to a different depth within said at least one portion of said at least one object, wherein at least two of said at least two of images are produced for different energy ranges.

79. The imaging system of claim 78, wherein said at least one position sensitive direct conversion detector has a plurality of pixels.

80. The imaging system of claim 78, wherein said at least one portion of radiation emitted from said at least one source of radiation is selected from the group consisting of positrons, electrons and photons.

81. The imaging system of claim 79, wherein said at least one signal is transferred from pixel to pixel within said plurality of pixels timed to a scan speed of said at least one position sensitive direct conversion detector.

82. The imaging system of claim 78, wherein said at least one position sensitive direct conversion detector is made to form an abuttable design wherein the abuttable design is selected from the group consisting of two-side abuttable, three-side abuttable and four-side abuttable design.

83. The imaging system of claim 81, wherein said at least one charge signal is accumulated across at least one column of pixels in the opposite direction of said scan motion and output at least at one position of said at least one column of pixels.

84. The imaging system of claim 78, wherein said at least one charge signal is accumulated over a plurality sections of said at least one position sensitive direct conversion detector using said at least one integrated circuit and output at multiple points across said at least one position sensitive direct conversion detector using said at least one integrated circuit.

85. The imaging system of claim 78, further comprising sequentially reading out alternating pixels of the detector, wherein scanning said at least one object is performed linearly.

87. The imaging system of claim 78, wherein said at least one signal is at least one count signal used to produce said at least one image.

88. The imaging system of claim 87, wherein said at least one processing system produces at least two images using said at least one count signal for different energy ranges.

89. The imaging system of claim 78, wherein TDI technique is used.

106. The imaging system of claim 78, wherein said at least one integrated circuit is disposed under said at least one position sensitive direct conversion detector.

107. The imaging system of claim 106, wherein at least one mounting board is disposed in between said at least one integrated circuit and said at least one position sensitive direct conversion detector.

86. (canceled)

92. An imaging system comprising in combination:

at least one source of radiation;

at least one four-side abuttable position sensitive direct conversion detector system, wherein said at least one four-side abuttable position sensitive direct conversion detector system produces at least one charge signal from at least one portion of radiation emitted from said at least one source of radiation and wherein said at least one source of radiation directed to said at least one four-side abuttable position sensitive direct conversion detector system;

at least one integrated circuit disposed under said at least one four-side abuttable position sensitive direct conversion detector system, wherein said at least one integrated circuit produces at least one signal from said at least one charge signal and wherein said at least one integrated circuit is a mixed signal integrated circuit having at least one analog circuit and at least one digital circuit;

at least one object placed between said at least one source of radiation and said at least one four-side abuttable position sensitive direct conversion detector system;

at least one processing system responsive to said at least one signal; and

said at least one processing system that processes said at least one signal to produce at least one image of at least one portion of said at least one object, wherein said at least one processing system produces at least two images each one for a different energy range.

93. The imaging system of claim 92, wherein said at least one position sensitive direct conversion detector has a plurality of pixels.

94. The imaging system of claim 92, wherein said at least one portion of radiation emitted from said at least one source of radiation is selected from the group consisting of positrons, electrons and photons.

95. The imaging system of claim 93, wherein said at least one signal is transferred from pixel to pixel within said plurality of pixels.

96. The imaging system of claim 92, wherein said at least one four-side abuttable position sensitive direct conversion detector is comprises at least two four-side abuttable position sensitive direct conversation detectors positioned to abut one another.

97. The imaging system of claim 95, wherein said at least one charge signal is accumulated across at least one column of pixels.

98. The imaging system of claim 92, wherein said at least one charge signal is accumulated over a plurality sections of said at least one four-side abuttable position sensitive direct conversion detector using said at least one integrated circuit and output at multiple points across said at least one position sensitive direct conversion detector using said at least one integrated circuit.

99. The imaging system of claim 92, wherein said at least one image consists of plurality of images wherein each image correspond to different depths within said at least one object.

100. The imaging system of claim 92, wherein said at least one processing system produces at least two images each one for a different energy range.

101. The imaging system of claim 92, wherein said at least one signal is used to produce at least two images, wherein each image is for a different energy range.

102. The imaging system of claim 101, wherein said at least one processing system produces at least one image for said at least one energy range using said at least one count signal.

103. The imaging system of claim 92, wherein TDI technique is used.

108. The imaging system of claim 92, wherein at least one mounting board is disposed in between said at least one integrated circuit and said at least one position sensitive direct conversion detector.

109. A method for producing a plurality of images, comprising the steps of:

using at least one source of radiation;

constructing at least one position sensitive direct conversion detector;

producing at least one charge signal from at least one portion of radiation emitted from said at least one source of radiation in said at least one position sensitive direct conversion detector;

coupling at least one integrated circuit to said at least one position sensitive direct conversion detector, wherein said at least one integrated circuit produces at least one signal from said at least one charge signal;

partitioning at least one portion of said at least one signal into at least two energy [[bins]] ranges;

directing said at least one source of radiation to at least one portion of said at least one position sensitive direct conversion detector;

placing at least one portion of at least one object between said at least one source of radiation and said at least one position sensitive direct conversion detector;

imaging at least one portion of said at least one object by said at least one position sensitive direct conversion detector; and

producing a plurality of images simultaneously of said at least one portion of said at least one object, wherein at least two of said plurality of images corresponds to said at least two energy ranges.

111. The method of claim 109, wherein said at least one position sensitive direct conversion detector has a plurality of pixels.

113. The method of claim 109, wherein said radiation is selected from the group consisting of positrons, electrons and photons.

110. An imaging system comprising in combination:

at least one source of radiation;

at least one position sensitive direct conversion detector, wherein said at least one position sensitive direct conversion detector produces at least one charge signal from at least one portion of radiation emitted from said at least one source of radiation and wherein said at least one source of radiation is directed to at least one portion of said at least one position sensitive direct conversion detector;

at least one integrated circuit coupled to said at least one position sensitive direct conversion detector, wherein said at least one integrated circuit produces at least one signal from said at least one charge signal,

wherein at least one portion of said at least one signal is partitioned into at least two energy ranges;

at least one portion of at least one object placed between said at least one source of radiation and said at least one position sensitive direct conversion detector, wherein said at least one position sensitive direct conversion detector images said at least one portion of said object; and

at least one processing system that processes said at least one signal partitioned into said at least two energy ranges to produce simultaneously at least two images for said at least one portion of said at least one object, wherein each of said at least two images corresponds to said at least two energy ranges.

112. The imaging system of claim 110, wherein said at least one position sensitive direct conversion detector has a plurality of pixels.

114. The imaging system of claim 110, wherein said radiation is selected from the group consisting of positrons, electrons and photons.

115. A method for producing at least one four side abuttable detector, comprising the steps of:

producing at least one integrated circuit with contact pads on at least one surface;

using at least one detector material sensitive to radiation with electrodes on at least one surface with matching area to said at least one integrated circuit, wherein said at least one detector material has a two-dimensional surface area that covers at least all of a surface of said at least one integrated circuit;

making a plurality of vias through said at least one integrated circuit to establish an electrical contact between top and bottom surfaces of the at least one integrated circuit;

mounting said at least one detector material on top of said at least one integrated circuit to form at least one four side abuttable detector;

processing a plurality of signals produced inside said at least one detector material by said at least one integrated circuit; and

outputting said processed plurality of signals from said at least one four side abuttable detector through at least one portion of said plurality of vias.

119. The method of claim 115, wherein said radiation is selected from the group consisting of positrons, electrons and photons.

123. The method of claim 115, wherein said at least one four side abuttable detector mounted side by side to form at least one large detector array.

127. The method of claim 115, wherein said at least one four side abuttable detector connected to at least one circuit board that collects data from said at least one four side abuttable detector.

116. A method for producing at least one four side abuttable detector, comprising the steps of:

producing at least one integrated circuit with contact pads on at least one surface;

making at least one connection board with connection pads on at least one surface with matching area to said at least one integrated circuit;

using at least one detector material sensitive to radiation with electrodes on at least one surface with matching area to said at least one integrated circuit, wherein said at least one detector material has a two-dimensional surface area that covers at least all of a surface of said at least one integrated circuit;

making a plurality of vias through said at least one integrated circuit and said at least one connection board to establish electrical contact between top and bottom surfaces;

stacking said at least one detector material, said at least one connection board and said at least one integrated circuit on top of one another in any order to form said at least one four side abuttable detector;

processing a plurality of signals produced inside said at least one detector material by said at least one integrated circuit; and

outputting said processed plurality of signals from said at least one four side abuttable detector through at least one portion of said plurality of vias.

120. The method of claim 116, wherein said radiation is selected from the group consisting of positrons, electrons and photons.

124. The method of claim 116, wherein said at least one four side abuttable detector mounted side by side to form at least one large detector array.

128. The method of claim 116, wherein said at least one four side abuttable detector connected to at least one board that collects data from said at least one four side abuttable detector.

117. A four side abuttable detector, comprising in combination:

at least one material sensitive to radiation with electrodes on at least one surface with matching area to said at least one integrated circuit;

at least one integrated circuit with contact pads on at least one surface, wherein said at least four side abuttable integrated circuit processes a plurality of signals produced inside said at least one detector material, and wherein said at least one material has a two-dimensional surface area that covers at least all of a surface of said at least one integrated circuit; and

a plurality of vias through said at least one integrated circuit to establish electrical contact between top and bottom surfaces of said at least one integrated circuit, connected to at least one of said contact pads, wherein said at least one detector material is stacked on top of said at least one integrated circuit to form at least one four side abuttable detector.

121. The detector system of claim 117, wherein said radiation is selected from the group consisting of positrons, electrons and photons.

125. The detector system of claim 117, wherein said at least one four side abuttable detector mounted side by side to form at least one large detector array.

129. The detector system of claim 117, wherein said at least one four side abuttable detector connected to at least one board that collects data from said at least one four side abuttable detector.

118. A four side abuttable detector, comprising in combination:

at least one connection board with connection pads on at least one surface;

at least one detector material sensitive to radiation with electrodes on at least one surface,

wherein said at least one detector material has a two-dimensional surface area that covers at least all of a surface of said at least one connection board;

at least one integrated circuit with connection pads on at least one surface,

wherein said two-dimensional surface area of said at least one detector material covers at least all of a surface of said at least one integrated circuit,

wherein said at least one detector material, said at least one connection board and said at least one integrated circuit are stacked on top of one another in any order, and

wherein said at least one integrated circuit processes a plurality of signals produced inside said at least one detector material, and;

a plurality of vias through said at least one integrated circuit and said at least one connection board that establishes an electrical contact between top and bottom surfaces of said at least one integrated circuit and said at least one connection board, wherein said plurality of signals are transferred through at least one portion of said plurality of vias.

122. The detector system of claim 118, wherein said radiation is selected from the group consisting of positrons, electrons and photons.

126. The detector system of claim 118, wherein said at least one four side abuttable detector mounted side by side to form at least one large detector array.

130. The detector system of claim 118, wherein said at least one four side abuttable detector connected to at least one board that collects data from said at least one four side abuttable detector.