ELECTROMAGNETIC WAVE SHIELDING GASKET HAVING ELASTICITY AND ADHESIVENESS

• US 20090291608A1
• Filed: 06/29/2007
• Published: 11/26/2009
• Est. Priority Date: 07/04/2006
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Kim, Won-Sik, Choi, Jeongwan, Jeong, Hun
• Application Number:
  US12/305,005
• Publication Number:
  US 20090291608A1
• Time in Patent Office: Days
• US Class Current: 442/394
• CPC Class Codes: H05K 9/0015 Gaskets or seals
• CPC Class Codes: H05K 9/0096 for television displays, e.g. plasma display panel
• CPC Class Codes: Y10T 428/249921 Web or sheet containing structurally defined element or component
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/266 of base or substrate
• CPC Class Codes: Y10T 428/269 including synthetic resin or polymer layer or component
• CPC Class Codes: Y10T 428/31678 Of metal
• CPC Class Codes: Y10T 442/674 Nonwoven fabric with a preformed polymeric film or sheet

Abstract

Disclosed is a gasket having electric and adhesive properties as well as electromagnetic wave shielding functions and a method for manufacturing the same. The gasket includes an adhesive polymer sheet having electrical conductivity and being disposed in the longitudinal and transverse directions of an electroconductive substrate, so that the gasket has impact and vibration absorbing properties in addition to an adhesive property.

Claims

1-29. -29. (canceled)

30. A gasket comprising:

an electroconductive substrate; and

an adhesive polymer sheet having electrical conductivity and being aligned on the electroconductive substrate, wherein

the adhesive polymer sheet includes adhesive polymer resin and conductive fillers distributed in the adhesive polymer resin, and

the conductive fillers are aligned in both longitudinal and transverse directions in the adhesive polymer resin while being electrically connected with each other over a whole area of the adhesive polymer sheet.

31. The gasket of claim 30, wherein the adhesive polymer sheet has a thickness of about 25 μ

m to 3 mm.

32. The gasket of claim 30, wherein the electroconductive substrate has a thickness of about 0.2 to 1 mm.

33. The gasket of claim 30, wherein the electroconductive substrate includes one selected from the group consisting of conductive fabrics, conductive non-woven fabrics, conductivity-treated fabrics, conductivity-treated non-woven fabrics, metal foils, metal films and conductive mesh film manufactured by coating a conductive mesh with a polymer resin.

34. The gasket of claim 30, wherein a surface of the electroconductive substrate, in which the adhesive polymer sheet is not aligned, is treated with release coating.

35. The gasket of claim 30, wherein amount of the conductive fillers ranges from 5 to 500 parts by weight based on 100 parts by weight of the adhesive polymer resin.

40. The gasket of claim 30, wherein the conductive filler is selected from noble metals;

non-noble metals;

noble metal-plated noble or non-noble metals;

non-noble metal-plated noble and non-noble metals;

noble or non-noble metal plated non-metals;

conductive non-metals;

conductive polymers; and

mixtures thereof.

41. The gasket as claimed in claim 40, wherein

the noble metals include gold, silver, platinum,

the non-noble metals include nickel, copper, tin, aluminum, and nickel;

the noble metal-plated noble or non-noble metals include silver-plated copper, nickel, aluminum, tin, and gold;

the non-noble metal-plated noble and non-noble metals include nickel-plated copper and silver;

the noble or non-noble metal plated non-metals include silver or nickel-plated graphite, glass, ceramics, plastics, elastomers, and mica;

the conductive non-metals include carbon black and carbon fiber; and

conductive polymers include polyacetylene, polyaniline, polypyrrole, polythiophene poly sulfurnitride poly(p-phenylene), poly(phenylene sulfide) and poly(p-phenylenevinylene).

42. The gasket of claim 30, wherein the conductive fillers include nickel-coated graphite fiber and nickel particles, wherein the fibers have a length of about 10 to 200 μ

m and a thickness of about 5 to 20 μ

m.

43. The gasket of claim 30, wherein the electroconductive substrate is a conductive mesh film, and the conductive mesh film is incorporated into the adhesive polymer sheet.

44. A method for fabricating a gasket including an electroconductive substrate and an adhesive polymer sheet having electrical conductivity and being aligned on the electroconductive substrate, the method comprising:

preparing a mixture by mixing a monomer for forming adhesive polymer resin with conductive fillers;

fabricating the mixture in a form of a sheet;

aligning a mask having a masking pattern at both surfaces of the sheet and photopolymerizing the adhesive polymer resin by irradiating light onto the sheet through the mask, thereby fabricating the adhesive polymer sheet in which the conductive fillers are aligned in both longitudinal and transverse directions of the adhesive polymer resin while being electrically connected; and

providing the adhesive polymer sheet on one surface of the electroconductive substrate.

45. The method of claim 44, wherein mixing the monomer with the conductive fillers includes:

forming polymer syrup by partially polymerizing the monomer for the adhesive polymer resin; and

adding the conductive fillers to the polymer syrup obtained by partially polymerizing the monomer.

46. The method of claim 44, wherein light is irradiated onto the mixture under a condition where the amount of oxygen is less than 1000 ppm.

47. The method of claim 44, wherein the mask has a masking pattern that includes a mesh net, a lattice, a release sheet having a predetermined masking pattern or a conductive mesh film with a polymeric coating.

48. A method for fabricating a gasket including an electroconductive substrate and an adhesive polymer sheet having electrical conductivity and being aligned on the electroconductive substrate, the method comprising:

forming polymer syrup by partially polymerizing a monomer for forming adhesive polymer resin;

adding conductive fillers to the polymer syrup and uniformly mixing the mixture;

planarizing the polymer syrup having the conductive fillers in a form of a tape sheet and aligning a mask having a masking pattern on a surface of the polymer syrup;

irradiating light onto the surface of the polymer syrup through the mask such that the adhesive polymer resin is photopolymerized, thereby fabricating the adhesive polymer sheet, in which the conductive fillers are aligned in both longitudinal and transverse directions of the adhesive polymer resin while being electrically connected over a whole area of the adhesive polymer sheet; and

coating the adhesive polymer sheet onto one surface of the electroconductive substrate.