Thermoelectric Generator for Implants and Embedded Devices

• US 20090292335A1
• Filed: 05/21/2009
• Published: 11/26/2009
• Est. Priority Date: 05/22/2008
• Status: Abandoned Application

• Current Assignee: Stichting Imec Nederland
• Original Assignee: Stichting Imec Nederland
• Inventors: Leonov, Vladimir
• Application Number:
  US12/470,232
• Publication Number:
  US 20090292335A1
• Time in Patent Office: Days
• US Class Current: 607/35
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction

Abstract

The present invention provides a TEG device comprising a first unit comprising a thermopile unit and a second unit comprising a cold plate and/or a radiator. One of the first and second units is adapted for being embedded or implanted into a body, while the other of the first and second units is adapted for being placed at the outer surface of the body, i.e. in a fluid. The first and second units are adapted for being thermally connected to each other through the surface between the body and the fluid when in use.

Claims

1. A TEG device comprising

a first unit comprising a thermopile unit, and

a second unit comprising a cold plate, a radiator, or both, one of the first or second units being an embeddable unit adapted for being embedded in an object, the other one of the first or second units being an external unit adapted for being placed on or near an interface between the object and surrounding fluid, the first unit and the second unit being adapted for being thermally connected to each other.

2. The TEG device according to claim 1, further comprising means for improving the heat flow through the first unit thermally connected to the second unit.

3. The TEG device according to claim 2, wherein the means for improving the heat flow comprises, at the first unit, a thermally conductive thermal matching plate, wherein the size of the thermal matching plate is substantially larger than the size of the thermopile unit in a direction parallel to the average plane of the matching plate.

4. The TEG device according to claim 3, wherein the first unit further comprises a thermally insulating element surrounding the thermal matching plate in a direction parallel to the average plane of the thermal matching plate, the size of the thermally insulating element being larger than the size of the thermal matching plate.

5. The TEG device according to claim 2, wherein the means for improving the heat flow comprises, at the first unit, a heat absorbing plate wherein the size of the heat absorbing plate is substantially larger than the size of the thermopile unit in a direction parallel to the average plane of the heat absorbing plate.

6. The TEG device according to claim 2, wherein the means for improving the heat flow comprises, at the second unit, a cold plate, wherein the size of the cold plate is substantially larger than the size of the thermopile unit in a plane parallel to the average plane of the cold plate.

7. The TEG device according to claim 4, wherein the means for improving the heat flow comprises, at the second unit, a cold plate, wherein the size of the cold plate is substantially larger than the size of the thermopile unit in a plane parallel to the average plane of the cold plate, and wherein the size of the thermally insulating element is larger than the size of the cold plate of the second unit in a plane parallel to the average plane of the thermal matching plate.

8. The TEG device according to claim 6, wherein the second unit comprises a thermally conductive element surrounding the cold plate in a direction parallel to the average plane of the cold plate.

9. The TEG device according to claim 8, wherein the size of the thermally conductive element is larger than the size of the thermal matching plate of the first unit in a plane parallel to the average plane of the cold plate.

10. The TEG device according to claim 1, further comprising alignment structures to align the second unit with the first unit.

11. The TEG device according to claim 1, furthermore comprising signal transmitters and receivers to provide for communication between the first unit and the second unit, with a remote device, or both.

12. The TEG device according to claim 1, wherein one of the first or second units is embedded in the object, the other one of the first or second units is placed on or near the interface between the object and surrounding fluid, and the first unit and the second unit are thermally connected to each other.

13. A method of using a TEG device according to claim 1, the method comprising powering an embedded device with the TEG device.

14. The method according to claim 13, wherein the embedded device is embedded into a mechanical structure.

15. A method of using a TEG device according to claim 1, the method comprising powering an implanted device with the TEG device.

16. The method according to claim 15, wherein the implanted device is implanted into a body of an endotherm.

17. A unit of a TEG device comprising a thermopile unit or a cold plate or a radiator, wherein the unit is adapted for being placed on or near an interface between an object and surrounding fluid, and wherein the unit is adapted for being thermally connected to an embedded unit embedded in the object.