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MULTI-CHIP PACKAGE

  • US 20090293604A1
  • Filed: 05/29/2008
  • Published: 12/03/2009
  • Est. Priority Date: 05/29/2008
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a leadframe comprising a first side and a second side, wherein the second side comprises a first landing pad for a surface mount component;

    a first integrated circuit die bonded to the first side of the leadframe; and

    a package to encapsulate at least a portion of the first integrated circuit and at least a portion of the leadframe, wherein at least a portion of the first landing pad is not encapsulated by the package.

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