ADHESION TYPE AREA SENSOR AND DISPLAY DEVICE HAVING ADHESION TYPE AREA SENSOR
First Claim
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1. A semiconductor device comprising:
- a pixel having a light receiving portion and a display portion, the pixel comprising a thin film transistor and a photodiode,wherein the thin film transistor includes a semiconductor layer,wherein the photodiode includes a photoelectric conversion layer,wherein the semiconductor layer and the photoelectric conversion layer are formed on a same surface, andwherein the pixel is configured to irradiate the photoelectric conversion layer with the reflected light when a light from the display portion is reflected by a subject.
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Abstract
A lightweight, thin, small size semiconductor device is provided. A pixel has a display portion, and a light receiving portion comprising a photodiode. A transistor is used with the semiconductor device for controlling the operation of the display portion and the-light receiving portion.
147 Citations
18 Claims
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1. A semiconductor device comprising:
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a pixel having a light receiving portion and a display portion, the pixel comprising a thin film transistor and a photodiode, wherein the thin film transistor includes a semiconductor layer, wherein the photodiode includes a photoelectric conversion layer, wherein the semiconductor layer and the photoelectric conversion layer are formed on a same surface, and wherein the pixel is configured to irradiate the photoelectric conversion layer with the reflected light when a light from the display portion is reflected by a subject. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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a driver portion having a first thin film transistor; and a sensor portion configured to display an image by using a light emitted from a light source, the sensor portion having a second thin film transistor and a photodiode, wherein the first thin film transistor includes a first semiconductor layer formed on a base film over a glass substrate, wherein the second thin film transistor includes a second semiconductor layer formed on the base film over the glass substrate, wherein the photodiode includes a third semiconductor layer formed on the base film over the glass substrate, and wherein the sensor portion is configured to irradiate the third semiconductor layer with the reflected light when the light emitted from the light source is reflected by a subject. - View Dependent Claims (6, 7, 8, 9)
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10. A semiconductor device capable of scanning an image of a subject comprising:
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a pixel having a light receiving portion and a display portion, the pixel comprising a thin film transistor and a photodiode, wherein the thin film transistor includes a semiconductor layer, wherein the photodiode includes a photoelectric conversion layer, wherein the semiconductor layer and the photoelectric conversion layer are formed on a same surface, and wherein the pixel is configured to receive a reflected light from the subject in order to scan the image of the subject. - View Dependent Claims (11, 12, 13)
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14. A semiconductor device capable of scanning an image of a subject comprising:
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a driver portion having a first thin film transistor; and a sensor portion configured to display an image by using a light emitted from a light source, the sensor portion having a second thin film transistor and a photodiode, wherein the first thin film transistor includes a first semiconductor layer formed on a base film over a glass substrate, wherein the second thin film transistor includes a second semiconductor layer formed on the base film over the glass substrate, wherein the photodiode includes a third semiconductor layer formed on the base film over the glass substrate, and wherein the sensor portion is configured to receive a reflected light from the subject in order to scan the image of the subject. - View Dependent Claims (15, 16, 17, 18)
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Specification