LIGHT SOURCE MODULE, RELATED LIGHT BAR AND RELATED LIQUID CRYSTAL DISPLAY

• US 20090296389A1
• Filed: 05/29/2009
• Published: 12/03/2009
• Est. Priority Date: 05/30/2008
• Status: Abandoned Application

• Current Assignee: Epistar Corporation (Ennostar, Inc.)
• Original Assignee: Epistar Corporation (Ennostar, Inc.)
• Inventors: HSU, Chia-Liang
• Application Number:
  US12/475,128
• Publication Number:
  US 20090296389A1
• Time in Patent Office: Days
• US Class Current: 362/235
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133605 including specially adapted reflectors
• CPC Class Codes: G02F 1/133611 including means for improving the brightness uniformity
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A light source module includes a bottom circuit board, a plurality of LED chips disposed on the bottom circuit board, and a sealant covering the LED chips. Each LED chip includes a light-emitting structure and at least a patterned reflecting layer disposed on the light-emitting structure. The patterned reflecting layer can appropriately enhance the brightness of the lateral surface of the LED chip. Thus, the diffuser particles included in the sealant can diffuse light so that the light beams emitted from the lateral surfaces of the LED chips can exit from the light-exiting surface of the light source module. Accordingly, a uniform light distribution of the light source module can be provided.

Claims

1. A light source module, comprising:

a first PCB;

a plurality of LED chips, located on a top surface of the first PCB and electrically connecting with the first PCB, each of the plurality of LED chips comprising;

a light-emitting structure; and

at least a patterned reflective layer, located on the light-emitting structure, wherein the patterned reflective layer comprises at least an opening and a reflective region, the opening occupies at most 20% of the area of the patterned reflective layer; and

an sealant, covering the plurality of LED chips, wherein a top surface of the sealant forms a main surface of light extraction of the light source module.

2. The light source module as described in claim 1, wherein the patterned reflective layer is a first electrode.

3. The light source module as described in claim 1, wherein each of the plurality of LED chips further comprises a reflective layer under the light-emitting structure.

4. The light source module as described in claim 1, wherein a light-emitting intensity of a top surface of each of the plurality of LED chips is lower than that of a lateral surface thereof.

5. The light source module as described in claim 1, further comprising a second PCB located on the plurality of LED chips, wherein the second PCB is a transparent PCB.

6. The light source module as described in claim 1, wherein each of the plurality of LED chips comprises a first electrode located on a top surface of the LED chip.

7. The light source module as described in claim 6, wherein the first electrode is a portion of the patterned reflective layer.

8. The light source module as described in claim 6, wherein the patterned reflective layer is located between the first electrode and the light-emitting structure.

9. The light source module as described in claim 6, wherein the first electrode is a patterned electrode, the patterned electrode and the patterned reflective layer comprise the same pattern.

10. The light source module as described in claim 1, wherein the opening comprises a circle opening or a grid opening.

11. The light source module as described in claim 1, wherein the light source module is an LB.

12. The light source module as described in claim 1, wherein the sealant comprises a plurality of diffusing particles.

13. The light source module as described in claim 1, wherein the light-emitting structure comprises:

a light-emitting stacked layer, located between the first PCB and the patterned reflective layer; and

a reflective layer, located between the light-emitting stacked layer and the first PCB.

14. The light source module as described in claim 1, wherein the light-emitting structure comprises a transparent substrate.

15. A BLU, comprising:

the light source module as described in claim 1; and

at least an optical film, located on the periphery of the light source module.

16. An LED chip, comprising:

a light-emitting structure, comprising a light-emitting stacked layer; and

at least a patterned reflective layer, located on the light-emitting structure, wherein the patterned reflective layer comprises at least an opening and a reflective region, the opening occupies at most 20% of an area of the patterned reflective layer.

17. The LED chip as described in claim 16, further comprising a reflective layer, located under the substrate or between the light-emitting stacked layer and the substrate.

18. The LED chip as described in claim 17, wherein the substrate is transparent.

19. The LED chip as described in claim 16, wherein the opening comprises a circle.