BTE/CIC AUDITORY DEVICE AND MODULAR CONNECTOR SYSTEM THEREFOR

• US 20090296969A1
• Filed: 08/07/2009
• Published: 12/03/2009
• Est. Priority Date: 08/10/2001
• Status: Active Grant

• Current Assignee: Hear-Wear Technologies LLC
• Original Assignee: Hear-Wear Technologies LLC
• Inventors: Feeley, Jim, Feeley, Mike
• Granted Patent: US 8,094,850 B2
• Time in Patent Office: Days
• US Class Current: 381/330
• CPC Class Codes: B33Y 70/00 Materials specially adapted for additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H04R 1/1016 Earpieces of the intra-aural type
• CPC Class Codes: H04R 1/1058 Manufacture or assembly
• CPC Class Codes: H04R 2225/0213 Constructional details of earhooks, e.g. shape, material
• CPC Class Codes: H04R 2225/57 Aspects of electrical interconnection between hearing aid parts
• CPC Class Codes: H04R 25/554 using a wireless connection, e.g. between microphone and amplifier or using Tcoils
• CPC Class Codes: H04R 25/604 of acoustic or vibrational transducers
• CPC Class Codes: H04R 25/607 of earhooks
• CPC Class Codes: H04R 25/609 of circuitry of electronic switches or control elements H04R25/603
• CPC Class Codes: H04R 25/652 Ear tips; Ear moulds hybrid ear moulds or post-processing thereof for their customisation H04R25/659
• CPC Class Codes: H04R 25/656 Non-customized, universal ear tips, i.e. ear tips which are not specifically adapted to the size or shape of the ear or ear canal

Abstract

An earpiece auditory device is described which includes a behind-the-ear component shaped to fit behind the ear of a user. The behind-the-ear component can also have at least one microphone and processing circuitry, where the processing circuitry is used to processes audio signal from the microphone. The device also includes a speaker sized to fit in the ear canal of a user, and an ear mold holding the speaker in place. The ear mold can also be position to touch the bony portion of the ear canal and provide sound attenuation in the ear canal. A connector physically and electrically connects the behind-the-ear component to the speaker. The connector is capable of being used to insert and remove the speaker and ear mold from the ear canal of the user.

Claims

1. A device for providing auditory signals to a user, the device comprising:

a speaker disposed in the ear canal of the user;

an ear mold designed to suspend the speaker in the ear canal of the users wherein the ear mold is an open ear mold; and

a connector used to provide electrical signals to the speaker, the connector being rigid enough to allow the connector to be used to insert and remove the speaker component from the ear canal of the user, wherein the connector is at least long enough to reach behind the ear of the user.

2. The device of claim 1 wherein the connector is electrically connected to a behind-the-ear components the behind-the-ear component including processing circuitry and at least one microphone connected to the processing circuitry.

3. The device of claim 2 wherein the connector is detachably coupled to either the speaker or the behind-the-ear device.

4. The device of claim 1 wherein the ear mold is a universal fit tip.

5. The device of claim 1 wherein the ear mold is a custom fit ear mold.

6. The device of claim 1 wherein the speaker is encased in a speaker module.

7. The device of claim 6 wherein the ear mold is attached to the speaker module.

8. An earpiece auditory device comprising:

a behind-the-ear (BTE) component the BTE component being shaped to fit behind an ear of a user;

a speaker component sufficiently small so as to be placed in the ear canal of the user;

an open fit ear mold designed to suspend the speaker in the ear canal of the user; and

a connector physically and communicatively coupling the BTE component to the speaker component, the connector being sufficiently rigid so as to allow the connector to be used to insert and remove the speaker component from the ear canal of the user.

9. The earpiece auditory device of claim 8 wherein the ear mold provides sound attenuation in the ear canal.

10. The earpiece auditory device of claim 8 wherein the ear mold is an open fit tip.

11. The earpiece auditory device of claim 8 further comprising a microphone port outside of the ear canal of the user, the microphone port providing sound to a microphone which is in electrical communication with the processing circuitry.

12. The earpiece auditory device of claim 8 wherein the ear mold is vented.

13. The earpiece auditory device of claim 8 wherein the ear mold is chosen from a plurality of ear molds to fit the ear canal of the user.

14. The earpiece auditory device of claim 8 wherein the connector is chosen from a plurality of connectors of different length to fit the ear of the user.

15. An earpiece auditory device comprising:

a behind-the-ear component shaped to fit behind the ear of a user, the behind-the-ear component including at least one microphone and processing circuitry, the processing circuitry for processing audio signal from the microphone;

a speaker sized to fit at least partially in the ear canal of a user;

an ear mold holding the speaker in place the ear mold touching the bony portion of the ear canal and providing sound attenuation in the ear canal; and

a connector physically and electrically connecting the behind-the-ear component to the speakers the connector capable of being used to insert and remove the speaker and ear mold from the ear canal of the user.

16. The earpiece auditory device of claim 15 wherein the ear mold is a universal fit ear mold.

17. The earpiece auditory device of claim 16 wherein the universal fit ear mold is a pliant mushroom tip ear mold.

18. The earpiece auditory device of claim 15 wherein the ear mold is a custom fit ear mold.

19. The earpiece auditory device of claim 15 wherein the connector and ear mold are selectable from a plurality of connectors and ear molds of varying dimensions.

20. The earpiece auditory device of claim 15 wherein the speaker is disposed in a speaker casing and the ear mold attaches to the speaker casing.