PLATING APPARATUS AND PLATING METHOD

• US 20090301395A1
• Filed: 08/19/2009
• Published: 12/10/2009
• Est. Priority Date: 05/27/2003
• Status: Abandoned Application

• Current Assignee: Fumio Kuriyama, Junichiro Yoshioka, Kenji Kamoda, Kuniaki Horie, Masahiko Sekimoto, Nobutoshi Saito, Stephen Strausser, Takashi Takemura, Yasuhiko Endo, Yoshio Minami
• Original Assignee: Fumio Kuriyama, Junichiro Yoshioka, Kenji Kamoda, Kuniaki Horie, Masahiko Sekimoto, Nobutoshi Saito, Stephen Strausser, Takashi Takemura, Yasuhiko Endo, Yoshio Minami
• Inventors: Strausser, Stephen, Kamoda, Kenji, Saito, Nobutoshi, Takemura, Takashi, Yoshioka, Junichiro, Kuriyama, Fumio, Minami, Yoshio, Endo, Yasuhiko, Horie, Kuniaki, SEKIMOTO, Masahiko
• Application Number:
  US12/543,832
• Publication Number:
  US 20090301395A1
• Time in Patent Office: Days
• US Class Current: 118/668
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/6723 comprising at least one plating chamber electroless plating apparatuses C23C, electroplating apparatuses C25D
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys

Abstract

A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.

Claims

1-60. -60. (canceled)

61. A plating apparatus comprising:

a loading/unloading section configured to load and unload a cassette housing substrates;

a sensor provided in said loading/unloading section for detecting sizes of the substrates received in the cassette;

a plurality of tools corresponding to sizes of substrates to be plated;

a tool stocker to store said plurality of tools;

a plating section configured to perform at least a plating process;

a controller configured to select a tool corresponding to a size detected by said sensor from said plurality of tools; and

a transfer device configured to hold and transfer said tool selected by said controller to said plating section.