PRINTED CIRCUIT BOARD
First Claim
Patent Images
1. A printed circuit board, comprising:
- a main body defining a through hole configured for being connected to a grounding component;
a tin layer formed on a surface of the main body around the through hole for contacting the grounding component; and
a solder mask formed between a periphery of the through hole and the tin layer, wherein the solder mask prevents tin cream of the tin layer from flowing into the through hole.
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Accused Products
Abstract
A printed circuit board of the present disclosure includes a main body, a tin layer, and a solder mask. The main body defines a through hole configured for being connected to a grounding component. The tin layer is formed on a surface of the main body around the through hole. The tin layer contacts the grounding component. The solder mask is formed between a periphery of the through hole and the tin layer. The solder mask is configured to prevent tin cream of the tin layer from flowing into the through hole.
20 Citations
15 Claims
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1. A printed circuit board, comprising:
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a main body defining a through hole configured for being connected to a grounding component; a tin layer formed on a surface of the main body around the through hole for contacting the grounding component; and a solder mask formed between a periphery of the through hole and the tin layer, wherein the solder mask prevents tin cream of the tin layer from flowing into the through hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A printed circuit board, comprising:
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a main body defining a through hole configured for being connected to a grounding component;
a tin layer formed on a surface of the main body around the through hole, the tin layer comprising a plurality of portions and contacting the grounding component; anda solder mask configured for preventing tin cream of the tin layer from flowing into the through hole, wherein a first portion of the solder mask is formed between a periphery of the through hole and the tin layer, and a second portion of the solder mask is formed between adjacent portions of the tin layer. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification