FORMULATIONS FOR REMOVING COOPER-CONTAINING POST-ETCH RESIDUE FROM MICROELECTRONIC DEVICES
First Claim
Patent Images
1. A residue removal composition comprising at least one copper corrosion inhibitor and at least one solvent, wherein said concentrate is further characterized by comprising at least one of the following components (I)-(II):
- (I) at least one chelating agent;
or(II) at least one chelating agent and at least one etchant,wherein said residue removal concentrate is useful for removing post-etch and/or post-ash residue from a microelectronic device having said residue thereon.
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Abstract
A method and composition for removing copper-containing post-etch and/or post-ash residue from patterned microelectronic devices is described. The removal composition includes a diluent, a solvent and a copper corrosion inhibitor, wherein the diluent may be a dense fluid or a liquid solvent. The removal compositions effectively remove the copper-containing post-etch residue from the microelectronic device without damaging exposed low-k dielectric and metal interconnect materials.
119 Citations
39 Claims
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1. A residue removal composition comprising at least one copper corrosion inhibitor and at least one solvent, wherein said concentrate is further characterized by comprising at least one of the following components (I)-(II):
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(I) at least one chelating agent;
or(II) at least one chelating agent and at least one etchant, wherein said residue removal concentrate is useful for removing post-etch and/or post-ash residue from a microelectronic device having said residue thereon. - View Dependent Claims (4, 5, 7, 13, 14, 16, 18, 19)
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2. (canceled)
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3. (canceled)
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8-12. -12. (canceled)
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15. (canceled)
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17. (canceled)
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20. (canceled)
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21. (canceled)
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23. (canceled)
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24. (canceled)
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26. A kit comprising, in one or more containers, residue removal composition reagents, wherein the residue removal composition comprises at least one copper corrosion inhibitor, at least one solvent, optionally at least one surfactant, and optionally at least one low-k passivating agent, wherein said composition is further characterized by comprising at least one of the following components (I)-(II):
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(I) at least one chelating agent;
or(II) at least one chelating agent, and at least one etchant, wherein the kit is adapted to form a residue removal composition suitable for removing copper-containing post-etch and/or post-ash residue from a microelectronic device having said residue thereon.
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27. A method of removing post-etch and/or post-ash residue from a microelectronic device having said residue thereon, said method comprising contacting the microelectronic device with a residue removal composition for sufficient time and under sufficient contacting conditions to at least partially remove said residue from the microelectronic device, wherein the residue removal composition comprises at least one copper corrosion inhibitor and at least one solvent, and wherein said composition is further characterized by comprising at least one of the following components (I)-(II):
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(I) at least one chelating agent;
or(II) at least one chelating agent, and at least one etchant. - View Dependent Claims (28, 29, 31, 32, 33, 34, 38)
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30. (canceled)
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35-37. -37. (canceled)
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39-45. -45. (canceled)
Specification