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FORMULATIONS FOR REMOVING COOPER-CONTAINING POST-ETCH RESIDUE FROM MICROELECTRONIC DEVICES

  • US 20090301996A1
  • Filed: 11/07/2006
  • Published: 12/10/2009
  • Est. Priority Date: 11/08/2005
  • Status: Abandoned Application
First Claim
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1. A residue removal composition comprising at least one copper corrosion inhibitor and at least one solvent, wherein said concentrate is further characterized by comprising at least one of the following components (I)-(II):

  • (I) at least one chelating agent;

    or(II) at least one chelating agent and at least one etchant,wherein said residue removal concentrate is useful for removing post-etch and/or post-ash residue from a microelectronic device having said residue thereon.

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