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Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference

  • US 20090302435A1
  • Filed: 06/04/2008
  • Published: 12/10/2009
  • Est. Priority Date: 06/04/2008
  • Status: Active Grant
First Claim
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1. A method of making a semiconductor device, comprising:

  • providing a first semiconductor wafer having a plurality of semiconductor die;

    creating a gap between the semiconductor die;

    depositing a conductive material in a bottom portion of the gap;

    depositing an insulating material in the gap and over the semiconductor die;

    removing a portion of the insulating material in the gap to form a recess between each semiconductor die extending to the conductive material;

    forming a shielding layer over the insulating material and in the recess to contact the conductive material, the shielding layer isolating the semiconductor die from inter-device interference;

    forming a substrate with a build-up structure on the semiconductor die adjacent to the conductive material;

    electrically connecting the conductive material to a ground point in the substrate; and

    singulating the first semiconductor wafer through the gap to separate the semiconductor die.

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