RESIN SEALED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

• US 20090302444A1
• Filed: 08/22/2008
• Published: 12/10/2009
• Est. Priority Date: 06/05/2008
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: UEDA, Tetsuya, Shirasawa, Takaaki
• Granted Patent: US 7,772,709 B2
• Time in Patent Office: Days
• US Class Current: 257/675
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49537 Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/117 Stacked arrangements of devices
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1301 : Thyristor
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance

Abstract

A resin sealed semiconductor device includes a first semiconductor switching device having a first emitter terminal and a first collector terminal bonded to its top and bottom surfaces respectively, a second semiconductor switching device having a second emitter terminal and a second collector terminal bonded to its top and bottom surfaces respectively, a first heat sink directly or indirectly bonded to the first collector terminal, a second heat sink directly or indirectly bonded to the second collector terminal, and a molding resin integrally covering the first and second semiconductor switching devices. The first and second heat sinks are exposed from the molding resin. The first emitter terminal faces and is spaced apart from the second emitter terminal.

Claims

1. A resin sealed semiconductor device comprising:

a first semiconductor switching device having an emitter in a top surface thereof and a collector in a bottom surface thereof;

a first emitter terminal bonded to said emitter of said first semiconductor switching device;

a first collector terminal bonded at a first surface thereof to said collector of said first semiconductor switching device;

a second semiconductor switching device having an emitter in a top surface thereof and a collector in a bottom surface thereof;

a second emitter terminal bonded to said emitter of said second semiconductor switching device;

a second collector terminal bonded at a first surface thereof to said collector of said second semiconductor switching device;

a first heat sink directly or indirectly bonded at a first surface thereof to a second surface of said first collector terminal, said second surface of said first collector terminal being opposite said first surface of said first collector terminal;

a second heat sink directly or indirectly bonded at a first surface thereof to a second surface of said second collector terminal, said second surface of said second collector terminal being opposite said first surface of said second collector terminal; and

a molding resin integrally covering said first and second semiconductor switching devices;

wherein a second surface of said first heat sink is exposed from said molding resin, said second surface of said first heat sink being opposite said first surface of said first heat sink;

wherein a second surface of said second heat sink is exposed from said molding resin, said second surface of said second heat sink being opposite said first surface of said second heat sink;

wherein said emitter of said first semiconductor switching device faces said emitter of said second semiconductor switching device; and

wherein said first emitter terminal is spaced apart from said second emitter terminal.

2. The resin sealed semiconductor device as claimed in claim 1, wherein said first and second emitter terminals and said first and second collector terminals are of plate-like shape and are disposed parallel to one another such that said first emitter terminal and said second collector terminal partially extend outwardly from said molding resin in a first direction and said first collector terminal and said second emitter terminal partially extend outwardly from said molding resin in a second direction different from said first direction.

3. The resin sealed semiconductor device as claimed in claim 2, further comprising:

a first bus bar disposed outside said molding resin and connected to said first collector terminal; and

a second bus bar disposed parallel to said first bus bar and outside said molding resin and connected to said second emitter terminal.

4. The resin sealed semiconductor device as claimed in claim 1, wherein:

said first and second semiconductor switching devices are IGBTs; and

said resin sealed semiconductor device further comprises;

a first diode covered with said molding resin and having a cathode and an anode connected to said first collector terminal and said first emitter terminal, respectively; and

a second diode covered with said molding resin and having a cathode and an anode connected to said second collector terminal and said second emitter terminal, respectively.

5. The resin sealed semiconductor device as claimed in claim 2, wherein a cooling structure is formed on a portion of at least one of said first and second emitter terminals and said first and second collector terminals to dissipate heat from the inside of said molding resin, said portion extending outwardly from said molding resin.

6. The resin sealed semiconductor device as claimed in claim 1, further comprising:

a connecting lead disposed within said molding resin and connected between said first emitter terminal and said second collector terminal.

7. The resin sealed semiconductor device as claimed in claim 1, further comprising:

an elastic structure disposed between said first emitter terminal and said second emitter terminal.

8. A resin sealed semiconductor device comprising:

a first semiconductor switching device having an emitter in a top surface thereof and a collector in a bottom surface thereof;

a second semiconductor switching device having an emitter in a top surface thereof and a collector in a bottom surface thereof;

a main electrode output terminal sandwiched between said top surface of said first semiconductor switching device and said bottom surface of said second semiconductor switching device;

a first collector terminal bonded at a first surface thereof to said collector of said first semiconductor switching device;

a second emitter terminal bonded at a first surface thereof to said emitter of said second semiconductor switching device;

a first high heat dissipation insulator of an organic composition directly or indirectly bonded at a first surface thereof to a second surface of said first collector terminal, said second surface of said first collector terminal being opposite said first surface of said first collector terminal;

a second high heat dissipation insulator of an organic composition directly or indirectly bonded at a first surface thereof to a second surface of said second emitter terminal, said second surface of said second emitter terminal being opposite said first surface of said second emitter terminal;

a first heat sink bonded at a first surface thereof to a second surface of said first high heat dissipation insulator, said second surface of said first high heat dissipation insulator being opposite said first surface of said first high heat dissipation insulator;

a second heat sink bonded at a first surface thereof to a second surface of said second high heat dissipation insulator, said second surface of said second high heat dissipation insulator being opposite said first surface of said second high heat dissipation insulator; and

a molding resin integrally covering said first and second semiconductor switching devices;

wherein a second surface of said first heat sink is exposed from said molding resin, said second surface of said first heat sink being opposite said first surface of said first heat sink;

wherein a second surface of said second heat sink is exposed from said molding resin, said second surface of said second heat sink being opposite said first surface of said second heat sink; and

wherein said first and second high heat dissipation insulators have a glass transition temperature lower than the temperature at which said molding resin softens.

9. A method for manufacturing a resin sealed semiconductor device, comprising the steps of:

bonding a first emitter terminal to an emitter formed in a top surface of a first semiconductor switching device;

bonding a first surface of a first collector terminal to a collector formed in a bottom surface of said first semiconductor switching device;

directly or indirectly bonding a first surface of a first heat sink to a second surface of said first collector terminal, said second surface of said first collector terminal being opposite said first surface of said first collector terminal;

bonding a second emitter terminal to an emitter formed in a top surface of a second semiconductor switching device;

bonding a first surface of a second collector terminal to a collector formed in a bottom surface of said second semiconductor switching device;

directly or indirectly bonding a first surface of a second heat sink to a second surface of said second collector terminal, said second surface of said second collector terminal being opposite said first surface of said second collector terminal;

placing said first and second semiconductor switching devices, said first and second emitter terminals, said first and second collector terminals, and said first and second heat sinks together in position within a cavity formed by an upper die and a lower die; and

injecting a molding resin into said cavity to integrally cover said first and second semiconductor switching devices;

wherein said placing step and said injecting step are performed such that;

a second surface of said first heat sink is in contact with an inner bottom surface of said lower die, said second surface of said first heat sink being opposite said first surface of said first heat sink;

a second surface of said second heat sink is in contact with an inner top surface of said upper die, said second surface of said second heat sink being opposite said first surface of said second heat sink;

said emitter of said first semiconductor switching device faces said emitter of said second semiconductor switching device; and

said first emitter terminal is spaced apart from said second emitter terminal.

10. The method as claimed in claim 9, wherein said placing step includes disposing an elastic structure between said first emitter terminal and said second emitter terminal.

11. The method as claimed in claim 9, wherein:

said first emitter terminal extends from said first semiconductor switching device in a first direction;

said first collector terminal extends from said first semiconductor switching device in a second direction different from said first direction;

said second emitter terminal extends from said second semiconductor switching device in said second direction;

said second collector terminal extends from said second semiconductor switching device in said first direction; and

said placing step includes the steps of;

placing said first emitter terminal and said first collector terminal on an upper surface of said lower die;

placing an intermediate die on said first emitter terminal and said first collector terminal;

placing said second emitter terminal and said second collector terminal on said intermediate die; and

placing said upper die on said second emitter terminal and said second collector terminal such that a lower surface of said upper die is pressed against a top surface of said second emitter terminal and a top surface of said second collector terminal.

12. A method for manufacturing a resin sealed semiconductor device, comprising the steps of:

bonding a first surface of a first collector terminal to a collector of a first semiconductor switching device, said first semiconductor switching device having an emitter in a top surface thereof and said collector in a bottom surface thereof;

directly or indirectly bonding a first surface of a first high heat dissipation insulator of an organic composition to a second surface of said first collector terminal, said second surface of said first collector terminal being opposite said first surface of said first collector terminal;

bonding a first surface of a first heat sink to a second surface of said first high heat dissipation insulator, said second surface of said first high heat dissipation insulator being opposite said first surface of said first high heat dissipation insulator;

bonding a first surface of a second emitter terminal to an emitter of a second semiconductor switching device, said second semiconductor switching device having said emitter in a top surface thereof and a collector in a bottom surface thereof;

directly or indirectly bonding a first surface of a second high heat dissipation insulator of an organic composition to a second surface of said second emitter terminal, said second surface of said second emitter terminal being opposite said first surface of said second emitter terminal;

bonding a first surface of a second heat sink to a second surface of said second high heat dissipation insulator, said second surface of said second high heat dissipation insulator being opposite said first surface of said second high heat dissipation insulator;

bonding and sandwiching a main electrode output terminal between said top surface of said first semiconductor switching device and said bottom surface of said second semiconductor switching device;

placing said first and second semiconductor switching devices, said first collector terminal, said second emitter terminal, said first and second high heat dissipation insulators, said first and second heat sinks, and said main electrode output terminal together in position within a cavity formed by an upper die and a lower die; and

injecting a molding resin into said cavity to integrally cover said first and second semiconductor switching devices;

wherein said first and second high heat dissipation insulators have a glass transition temperature lower than the temperature at which said molding resin softens; and

wherein said placing step and said injecting step are performed such that;

a second surface of said first heat sink is in contact with an inner bottom surface of said lower die, said second surface of said first heat sink being opposite said first surface of said first heat sink; and

a second surface of said second heat sink is in contact with an inner top surface of said upper die, said second surface of said second heat sink being opposite said first surface of said second heat sink.